Fully electrical test procedure for inertial MEMS characterization at wafer-level

Sisto, A.; Schwarzelbach, O.; Fanucci, Luca

doi:10.1109/prime.2013.6603130

Cited by 7 publications

(7 citation statements)

References 6 publications

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“…In previous studies [15][16][17][18][19][20][21][27][28][29][30][31][32][33][34][35][36][37][38][39][40][41], the focus was on developing a specific handler for a specific domain for ATE parallel testing. However, in a situation of existing different domains such as electrostatic, piezoelectric, and piezoresistive, a methodology capable of handling all the domains are required.…”

Section: Methodsmentioning

confidence: 99%

“…Therefore, Equation (19) shows the potential energy of MCL and Equation (10) shows the corresponding kinetic energy. To drive the equations of motion, the Hamiltonian principle is approached.…”

Section: Cl= Cn Cosα -Ca Sinα (4)mentioning

confidence: 99%

“…Therefore, these MEMS devices need a specified testing and characterization method. A sophisticated testing line has been established in Sandia National Laboratories (SHiMMeR-Sandia High-Volume Measurement of Micro-Machine Reliability), which is capable of simultaneous control and test of up to 256 MEMS devices, which is a lab test scale [19]. X-Ray Diffraction (XRD) has been adopted to test the creep of MEMS accelerometers, but is very slow in mass production [19,20].…”

Section: Introductionmentioning

confidence: 99%

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A New Non-Invasive Air-Based Actuator for Characterizing and Testing MEMS Devices

2020

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This research explores a new ATE (Automatic Testing Equipment) method for Micro Electro Mechanical Systems (MEMS) devices. In this method, microscale aerodynamic drag force is generated on a movable part of a MEMS sensor from a micronozzle hole located a specific distance above the chip that will result in a measurable change in output. This approach has the potential to be generalized for the characterization of every MEMS device in mass production lines to test the functionality of devices rapidly and characterize important mechanical properties. The most important testing properties include the simultaneous application of controllable and non-invasive manipulative force, a single handler for multi-sensor, and non-contact characterization, which are relatively difficult to find with other contemporary approaches. Here we propose a custom-made sensing platform consisting of a microcantilever array interconnected to a data acquisition device to read the capacitive effects of each cantilever’s deflection caused by air drag force. This platform allows us to empirically prove the functionality and applicability of the proposed characterization method using airflow force stimuli. The results, stimulatingly, exhibited that air force from a hole of 5 µm radii located 25 µm above a 200 × 200 µm2 surface could be focused on a circular spot with radii of approximately 5 µm with surface sweep accuracy of <8 µm. This micro-size airflow jet can be specifically designed to apply airflow force on the MEMS movable component surface. Furthermore, it was shown that the generated air force range could be controlled from 20 nN to 60 nN, approximately, with a linear dependency on airflow ranging from 5 m/s to 20 m/s, which is from a 5 µm radius microhole air jet placed 400 µm above the chip. In this case-study chip, for a microcantilever with a length of 400 µm, the capacitance curve increased linearly from 28.2 pF to 30.5 pF with airflow variation from 5 m/s to 21 m/s from a hole. The resultant curve is representative of a standard curve for testing of the further similar die. Based on these results, this paper paves the way towards the development of a new non-contact, non-invasive, easy-to-operate, reliable, and relatively cheap air-based method for characterizing and testing MEMS sensors.

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Section: Methodsmentioning

confidence: 99%

Section: Cl= Cn Cosα -Ca Sinα (4)mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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A New Non-Invasive Air-Based Actuator for Characterizing and Testing MEMS Devices

2020

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“…To test the validity of the presented m comb-drive was designed and simulated usi ed to: (9) ing Taylor series (10) …”

Section: Simulation Resulmentioning

confidence: 99%

“…In [9], a set of electrostatically actuated MEMS test structures is presented to monitor MEMS fabrication process and measure material properties. A fully electrical test procedure for characterization of MEMS at the wafer-level is presented in [10]. In this approach a test setup to measure electrical and mechanical parameters of capacitive MEMS sensors has been developed.…”

Section: Introductionmentioning

confidence: 99%

Resonant-based test method for MEMS devices

Dianat

Attaran

Rashidzadeh

et al. 2014

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)

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In this paper a test method for capacitive Micro-Electro-Mechanical Systems (MEMS) is presented. The proposed method utilizes the principle of resonant circuits to detect structural defects of capacitive MEMS devices. It is shown that a small variation of MEMS capacitance due to a defect alters the resonance frequency considerably. It is also shown that the variation of the output amplitude can be observed for fault detection if an inductor with a high quality factor is employed in the test circuit. Simulation results using an implemented MEMS comb-drive indicate that the proposed method can detect common faults such as missing, broken and short fingers.

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