Fully integrated system-on-chip for pixel-based 3D depth and scene mapping

Popp, Martin; Coi, Beat De; Thalmann, M.; Gancarz, Radoslav; Ferrat, Pascal; Dürmüller, Martin; Britt, Florian; Annese, Marco; Ledergerber, Markus; Catregn, Gion-Pol

doi:10.1117/12.917050

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Cited by 3 publications

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“…A hybrid ToF image sensor based on concentric photo-gate demodulators was presented by Mase et al [7]. A monolithic backside-illuminated ToF system-on-chip based on CCD/CMOS technology was demonstrated by M. Popp et al [8]. An IR Quantum Efficiency (QE) of 90% and a timing response of 16ns FWHM were shown.…”

Section: Introductionmentioning

confidence: 99%

IR-optimized silicon demodulating detector with 3-dimensional electrodes

Pancheri

Savazzi

Betta

et al. 2014

2014 44th European Solid State Device Research Conference (ESSDERC)

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A novel electro-optical demodulating detector with 3-dimensional electrodes is presented in this paper. Thanks to a large substrate thickness, this device can combine high responsivity and demodulation contrast in the infrared spectral region, as needed in Time-of-Flight optical ranging applications. Proof-of-concept large-area detectors are fabricated on Floating Zone silicon, using Deep Reactive Ion Etching to form throughsilicon columnar electrodes. The device operation principle is validated by experimental and simulation results. TCAD modeling is used to design detectors with scaled geometry suitable for integration in hybrid image sensors.

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Section: Introductionmentioning

confidence: 99%