2021
DOI: 10.1016/j.apmt.2021.101253
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Fully metallic copper 3D-printed electrodes via sintering for electrocatalytic biosensing

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Cited by 28 publications
(35 citation statements)
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“…Nanocomposites have been widely introduced in FFF materials [ 13 , 14 , 47 , 48 ], while the development of nanocomposites in SLA materials is still not widely investigated [ 12 , 13 , 23 ]. Copper (Cu) is a metallic material that has been used in several applications over the years [ 49 , 50 , 51 ]. Its ductile behavior and antibacterial properties introduced a definite advantage for composites’ development.…”
Section: Introductionmentioning
confidence: 99%
“…Nanocomposites have been widely introduced in FFF materials [ 13 , 14 , 47 , 48 ], while the development of nanocomposites in SLA materials is still not widely investigated [ 12 , 13 , 23 ]. Copper (Cu) is a metallic material that has been used in several applications over the years [ 49 , 50 , 51 ]. Its ductile behavior and antibacterial properties introduced a definite advantage for composites’ development.…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, the required activity is often low, and post-printing treatment is required for optimizing the functionality and activity of the printed parts . Recently, incorporating a high load of metal particles in PLA enabled the FDM 3D printing of copper/PLA objects, providing high thermal and electrical conductivity. However, devices printed with commercial metal/PLA filaments are often electrically insulating, and the removal of the non-conductive PLA and the sintering of the metal particles with temperatures around the melting point of the metal are required to obtain conductive parts. For this sintering process, the printed object is packed in a refractory material to prevent oxidation reactions, and to keep the 3D-printed part in shape until the particles are fused, and the object is cooled down to form a stable structure. Common refractory materials are graphite or Al 2 O 3 ; in principle, however, any material sustaining the sintering temperature can be used.…”
Section: Introductionmentioning
confidence: 99%
“…For the development of composites and nanocomposites with antibacterial properties, additives with such properties are introduced into the materials, with copper (Cu) and its oxides, such as copper (I) oxide (cuprous oxide, Cu 2 O), frequently used in the literature [ 8 , 32 , 34 , 35 ]. Cu in different types (nanopowder and others) has been widely used and investigated in the literature for various types of applications [ 59 , 60 , 61 , 62 ]. It has been processed and investigated in AM as well [ 60 , 61 , 63 , 64 , 65 , 66 ], with several works exploiting its antibacterial performance in AM [ 34 , 65 ].…”
Section: Introductionmentioning
confidence: 99%
“…Cu in different types (nanopowder and others) has been widely used and investigated in the literature for various types of applications [ 59 , 60 , 61 , 62 ]. It has been processed and investigated in AM as well [ 60 , 61 , 63 , 64 , 65 , 66 ], with several works exploiting its antibacterial performance in AM [ 34 , 65 ]. Cuprous oxide has been employed in semiconductors [ 67 , 68 ], among other applications; still, it is mainly used and investigated for its antibacterial properties [ 69 , 70 , 71 , 72 , 73 , 74 , 75 , 76 ].…”
Section: Introductionmentioning
confidence: 99%