2012
DOI: 10.1088/0957-4484/23/34/344006
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Fully roll-to-roll gravure printed rectenna on plastic foils for wireless power transmission at 13.56 MHz

Abstract: Wireless power transmission to inexpensive and disposable smart electronic devices is one of the key issues for the realization of a ubiquitous society where sensor networks such as RFID tags, price tags, smart logos, signage and sensors could be fully interconnected and utilized by DC power of less than 0.3 W. This DC power can be provided by inductively coupled AC from a 13.56 MHz power transmitter through a rectenna, consisting of an antenna, a diode and a capacitor, which would be cheap to integrate with i… Show more

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Cited by 74 publications
(73 citation statements)
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“…Thus, another strategy for printed UHF electronics would be to consider conventional inorganic semiconductors comprising high mobility and carrier concentration and modify the processing method to make it compatible with low-temperature processing and traditional printing techniques (13). One way to achieve this is to use nanoparticle semiconductor inks, a route that was successfully used to demonstrate fully printed rectennas, however presently limited to an operational frequency of 13.56 MHz (16). With advances in chemistry and nanotechnology, solutionprocessed inorganic semiconductors are now available (23,24).…”
mentioning
confidence: 99%
“…Thus, another strategy for printed UHF electronics would be to consider conventional inorganic semiconductors comprising high mobility and carrier concentration and modify the processing method to make it compatible with low-temperature processing and traditional printing techniques (13). One way to achieve this is to use nanoparticle semiconductor inks, a route that was successfully used to demonstrate fully printed rectennas, however presently limited to an operational frequency of 13.56 MHz (16). With advances in chemistry and nanotechnology, solutionprocessed inorganic semiconductors are now available (23,24).…”
mentioning
confidence: 99%
“…The suggested fabrication processes for these devices include modifying silicon wafers into ribbons or thinning them until they are flexible, using peel-and-stick, lift-off or transfer printing techniques, depositing silicon nanomembranes, or solution processing of silanes followed by annealing [8,9,23,[34][35][36][37][38][39][40]. Besides silicon, other materials such as ZnO, Ge and indium-gallium-zinc-oxide have also been used for high frequency (HF) or UHF devices [41][42][43]. Nevertheless, all the above works report production steps including high temperature, vacuum or other processes that are not feasible for industrial, mass-production procedures.…”
Section: Motivation and Goalmentioning
confidence: 99%
“…These parameters are the key factors for the development of demanding, miniature, and multifunctional communication systems for wireless sensor networks and smart electronic devices. The deposition of suitable metal ink on the prescribed flexible substrate for the fabrication of highly desirable electronic devices is a major challenge [4,5]. This metallization itself presents the challenge of the formulation of suitable silver (Ag) nanoparticle ink.…”
Section: Introductionmentioning
confidence: 99%