Functionalised copper nanoparticles as catalysts for electroless plating

The Efficacy of Polymer Coatings for the Protection of Electroless Copper Plated Polyester Fabric

“…With its high conductivity and ductility, copper (Cu) is one of the most attractive options for e-textiles and application on the surface of flexible, substrates. Electroless Cu deposition is a well-known, additive approach to coat non-conductive (dielectric) substrates, such as printed circuit boards [ 2 ], textile [ 3 ], glass [ 4 , 5 ] and ceramics [ 6 ], with a conductive, metallic layer. Electroless plating is a controllable, stable process, which includes a source of metal ions, reducing agents, complexing agents, a stabilizer, a buffering agent, and a wetting agent; with temperature, concentration of the reducing agent and pH as the most influential factors [ 7 ].…”

Advances in Pretreatments for Electroless Copper Plating on Polymer Materials

“…Azar 等 [9] 采用(3-氨基丙基)三乙氧基硅烷 (APTS)、油酸(OA)和聚丙烯酸(PAA)等功能化试剂与粒 径为 25 nm 的商用铜纳米粉末混合, 制备功能化的 Cu NPs. 功能化物质头部与基材相连, 尾部含有-COOH、 -NH 2 等官能团与 Cu 纳米颗粒相连, 使得纳米颗粒吸 附在基材表面 [60] . 涤纶纤维经功能化的 Cu NP-PAA 催 化剂处理后, 可得到薄层电阻为 8.7 mΩ/sq 的高覆盖度 金属铜薄膜.…”

Functionalised copper nanoparticle catalysts for electroless copper plating on textiles

“…Key parameters for wearable applications are flexibility, durability, weight and cost without changing the feel or texture of the textile [4], [6], [8], [12]. The scale-up of the experimental procedure is therefore an important consideration to produce complex electronic architectures on textiles [13]. Subtractive techniques such as etching and scouring in addition to the sensitisation, rinsing and activation steps which add complexity and cost in production of the coating should be avoided [4], [13].…”

“…Obtaining a uniform copper deposit is heavily dependent upon the efficacy of the catalyst. Palladium/tin colloid is by far the most widely used catalyst to activate the electroless plating quickly [6], [13].…”

“…However, with the increasing cost and lower supply of palladium [8], [16] as well as its presence on the critical raw materials list in Europe, palladium-free (Pd-free) catalysts are desirable [17]. Silver and copper are alternative candidates as catalysts for electroless plating; though copper is more favourable due to being earth abundant, its stability and significantly lower cost [8], [11], [13], [15], [16].…”