Functions of 2-butyne-1,4-diol in the process of tin-silver alloy electrodeposition from the acidic sulfate solution

The tin coating was elaborated electrolytically on an ordinary steel substrate in SnSO4 based electrolyte in acid medium with additive (bis-glycobenzimidazolone) at ambient temperature. The pH is maintained at 1.2±0.2 Bis-glycobenzimidazolone influence on the electrochemical properties of the tin coating was investigated using stationary polarization, chronopotentiometry, and cyclic voltammetry techniques. These studies show an apparent decrease in cathodic peak current and a drop in potential. The deposition rate also decreases as the concentration of the additive increases. SEM (Scanning Electron Microscopy) observation and XRD (X-ray Diffraction) analysis showed that the coating consists of good surface quality of the deposit elaborated by the addition of an optimal concentration of bis-glycobenzimidazolone (10-3M) in the electrolyte, which constitutes the continuation of a preliminary study.

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“…A more detailed mechanism is proposed in the literature with the formation of hydrated stannic complexes 22 :…”

Section: Time (S)mentioning

confidence: 99%

Electrochemical study and characterization of tin coatings with and without glucose-based additive

et al. 2021

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“…Thirdly, the introduction of a surfactant can be useful to change the structure of the Helmholtz layer and selectively affect the rate of metal ions reduction. Thus, Sn−Ag alloy of the eutectic composition has been deposited in an aqueous strongly acidic sulfate electrolyte containing 2‐butyne‐1,4‐diol [4] . This additive fulfilled the function of a surfactant and a selective ligand for Ag I ions which limits the rate of silver reduction.…”

Section: Introductionmentioning

confidence: 99%

“…Thus, SnÀ Ag alloy of the eutectic composition has been deposited in an aqueous strongly acidic sulfate electrolyte containing 2-butyne-1,4-diol. [4] This additive fulfilled the function of a surfactant and a selective ligand for Ag I ions which limits the rate of silver reduction.…”

Section: Introductionmentioning

confidence: 99%

“…Compositions of strongly acidic sulfate and slightly alkaline pyrophosphate solutions for the electrochemical synthesis of the SnÀ Ag alloy are known, which make it possible to obtain coatings with a silver content from 2-12 wt.% in acidic to 13-50 wt.% in alkaline solutions. [4][5][6][7] Strongly acidic solutions are much more stable than alkaline ones (up to 3-4 months of exploitation or storage). However, the hydrolysis can be completely excluded in non-aqueous solutions.…”

Section: Introductionmentioning

confidence: 99%

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Electrodeposition of a Near‐Eutectic Sn‐Ag Alloy from a Mixed Choline Chloride, Ethylene Glycol and Urea Electrolyte

2023

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Ternary mixture of choline chloride, ethylene glycol and urea (molar ratio 1 : 1 : 1) has been proposed as non-aqueous media for the electrochemical plating in galvanostatic mode of tinsilver alloy coatings. The conditions for the deposition of an alloy with a composition and melting temperature close to the eutectic, which is in demand for microassembly in the electronic industry, have been determined. The significant features on the simultaneous tin(II) and silver(I) reduction and the alloy formation are revealed. It has been determined that silver(I) is reduced from the solution both electrochemically and by the galvanic displacement with freshly deposited tin. The presence of silver on the surface of the coatings initiates underpotential tin(II) reduction. The interactions of components in the non-aqueous electrolyte have been studied for the first time by IR spectroscopy, and the formation of coordination compounds between tin(II) and silver(I) ions and solvent molecules has been revealed.

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“…In our article, we also analyse the quality of a solder joint created on 5 types of conventional surface finishes. We compare the results of these measurements with the results of the newly created surface, which is not yet applied in electronics, and which is based on the SnAg alloy [18][19][20][21].…”

Section: Introductionmentioning

confidence: 99%

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Dzivy,

Pietrikova,

Vrublevskaya

et al. 2021

Acta Electrotechnica Et Informatica

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The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow processes. The electrical resistivity was determined after 1, 2, 3, 5 and 6 reflow cycles as a replacement for the basic accelerated aging test. In this article, various surface finishes are compared by measuring electrical resistivity of solder joints between two soldering pads. The influence of standard surface finishes (ENIG, Lead HASL, Lead-free HASL, Cu, ImSn) with the new developed surface finish based on SnAg7 is also compared. Measurements show that the electrical resistivity is dependent on surface finish type and the thickness of the solder joint. The results prove that the new developed surface finish based on SnAg7 is stable against multiple reflows and comparable to the surface finish based on Au. The new developed surface finish based on SnAg7 can be recommended as a replacement for other conventional surface finishes.

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Functions of 2-butyne-1,4-diol in the process of tin-silver alloy electrodeposition from the acidic sulfate solution

Cited by 6 publications

References 27 publications

Electrochemical study and characterization of tin coatings with and without glucose-based additive

Electrochemical study and characterization of tin coatings with and without glucose-based additive

Electrodeposition of a Near‐Eutectic Sn‐Ag Alloy from a Mixed Choline Chloride, Ethylene Glycol and Urea Electrolyte

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

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