2000
DOI: 10.1109/28.833768
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Fundamental characteristics of electrostatic wafer chuck with insulating sealant

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Cited by 54 publications
(33 citation statements)
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“…However, then, this outcome is not uncommon, since several reports are readily available to support these results [5,6,13]. The existing model can only predict the quadratic F - V relation of such actuators within a certain voltage level.…”
Section: Resultsmentioning
confidence: 99%
“…However, then, this outcome is not uncommon, since several reports are readily available to support these results [5,6,13]. The existing model can only predict the quadratic F - V relation of such actuators within a certain voltage level.…”
Section: Resultsmentioning
confidence: 99%
“…The novel DEA design shows advantage for grasping application over traditional DEA design as it can produce up to 10 times higher electroadhesion forces at the cost of only ~20 % reduction in actuation performance. The total electroadhesion force generated from our DEA design, a bilayer offset interdigitated electrodes, can be much higher (order of several times) by optimizing the electrode geometry such as the gap and the segmented electrode width, and the thickness of the passive layer (Figure 4b-c), as has been suggested in electroadhesion devices with single surface electrode [50,[52][53][54] . The sensing capability of the device (Supplementary Figure S2) makes it an active smart skin enabling shape recognition to understand the object geometry when such information cannot be provided.…”
Section: Accepted In Advanced Materialsmentioning
confidence: 92%
“…Among many different types of electrodes examined, interdigital electrodes show the best features [11]. A basic model that can adequately describe the performance of the interdigital electrodes is depicted in Fig.…”
Section: B Force Calculationmentioning
confidence: 99%