2019
DOI: 10.1007/978-3-319-93988-9
|View full text |Cite
|
Sign up to set email alerts
|

Fundamentals of Power Semiconductor Devices

Abstract: of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specif… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

9
577
0
11

Year Published

2020
2020
2023
2023

Publication Types

Select...
4
4

Relationship

0
8

Authors

Journals

citations
Cited by 409 publications
(597 citation statements)
references
References 5 publications
9
577
0
11
Order By: Relevance
“…Gate S Drain Figure 2: A cross-sectional diagram of a Trench Power MOSFET device [4]. Therefore, control of these processes are critical an1 thus require monitoring and SPC control, preferably via an inline, real-time, non-destructive method.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…Gate S Drain Figure 2: A cross-sectional diagram of a Trench Power MOSFET device [4]. Therefore, control of these processes are critical an1 thus require monitoring and SPC control, preferably via an inline, real-time, non-destructive method.…”
Section: Methodsmentioning
confidence: 99%
“…This is especially key for implementation in high volume trench device manufacturing where the trench depth and contour are two of the most significant characteristics. The cross sectional diagram of the trench power MOSFET device seen in figure 2 illustrates the fact that the trench depth, contour, and fill are crucial to device yield and parametric performance [4].…”
Section: Introduction1mentioning
confidence: 99%
“…Widely used for the medium voltage and medium current applications range (300-2500V / 50-200A), it allows a good trade-off between the switching speed, the on-state voltage drop and the ruggedness [3]. Nowadays, the trench technology is also available for the IGBT devices [4]. In the early 90s, some prototypes of 600V Trench (T) IGBT were developed and experimentally compared to Planar (P) device [5].…”
Section: Introductionmentioning
confidence: 99%
“…The P--P' interface produces an 'ohmic' contact for majority carriers. The P--P' contact creates and electric field due to the concentration gradient [3]:…”
Section: Introductionmentioning
confidence: 99%
“…Consequently, the implementation of new circuit topologies and a tremendous increase in switching frequency to meet new limits, have been the driving factors in the development of new semiconductor devices such as power MOSFETs [I], insulated gate bipolar transistors (IGBTs) [2], the family of MOS-gated thyristors, and power field-controlled diodes (FCD) [3]. As a consequence, other devices, in particular the P-i-Nbased rectifier structure (usually called first recovery diode, FRD), became the weakest members of power circuits, and very often power circuits performance is limited by the power rectifier.…”
Section: Introductionmentioning
confidence: 99%