Fundamentals of Solder Alloys in 3D Packaging

Lin, Kwang Lung

doi:10.1007/978-3-319-44586-1_8

Cited by 3 publications

(1 citation statement)

References 39 publications

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“…Microbumps are desirable for joining owing to their capability to increase the circuit density from the substrate sides to several miniaturization chips. The most well-known method of preparing microbumps is the soldering process [ 51 ]. In this process, microbumps can be obtained in sizes ranging from 10 μm to 30 μm [ 52–54 ].…”

Section: Three-dimensional Integrated Circuits: the Technologymentioning

confidence: 99%

Intermetallic compounds in 3D integrated circuits technology: a brief review

Annuar

Mahmoodian

Hamdi

et al. 2017

Science and Technology of Advanced Materials

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The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

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Section: Three-dimensional Integrated Circuits: the Technologymentioning

confidence: 99%