2008
DOI: 10.1139/tcsme-2008-0031
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Fundamentals of the Squeeze-Flow Between a Heat Sink and a Flip-Chip

Abstract: The paper presents the fundamentals of the squeeze-flow of the thermal interface material (TIM) that takes place during the pressing of a heat sink to the back side of a flip-chip is studied. A two-dimensional string model is developed for predicting the time-varying plate separation and squeeze-rate in terms of the squeeze force. The predictions are compared to a one-dimensional string model and to a squeeze-drop flow model. Results indicate that the flow resulting from the squeezing of a string of TIM betwee… Show more

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Cited by 2 publications
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