2006 International Conference on Photonics in Switching 2006
DOI: 10.1109/ps.2006.4350170
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Fusion of Fiber-Optic and PCB Technologies for In-board Optical Interconnection

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Cited by 2 publications
(5 citation statements)
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“…This loss is 0.2 dB higher than the best data in our previous work [6],obtained from an active alignment of each component under a similar interconnection scheme. Considering that in this work all components are passively assembled, the loss of 1.5 Db near the best alignment data is a remarkable result.…”
Section: Introductioncontrasting
confidence: 50%
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“…This loss is 0.2 dB higher than the best data in our previous work [6],obtained from an active alignment of each component under a similar interconnection scheme. Considering that in this work all components are passively assembled, the loss of 1.5 Db near the best alignment data is a remarkable result.…”
Section: Introductioncontrasting
confidence: 50%
“…Keith et al (2011) formulated that the Optical links have successfully displaced electrical links when their aggregated bandwidth-distance product exceeds∼100 Gb/s-m because their link energy per bit per unit distance is lower [6]. Optical links will continue to be adopted at distances of 1mand below if link power falls below 1 pJ/bit/m.…”
Section: Introductionmentioning
confidence: 99%
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“…Digital Object Identifier 10.1109/JLT.2018.2881979 on short-distance communications in data centers, which realize new data center architecture with high data rates, compact and low power consumption using optical fibers, as well as optical interposers and optical boards [5], [6], which replace cable-based metal systems. Commercially available 100 Gbps (4λ × 25 Gbaud) transceivers have been utilized for data center and Ethernet communications applications [7], [8].…”
Section: Introductionmentioning
confidence: 99%