Abstract:This study investigates the gate degradation mechanisms of Schottky p-GaN gate high electron mobility transistors (HEMTs) systemically. The constant gate bias stress is applied to investigate the gate breakdown. Schottky p-GaN Gate HEMTs show a shorter gate lifetime as gate bias increases. The gate leakage current after gate breakdown shows a resistance-like characteristic. The equivalent circuit has been proposed to discuss the gate breakdown mechanisms. When applying a high gate bias for a long time, the hig… Show more
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