2016
DOI: 10.1088/0022-3727/49/44/445301
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Ge doping of GaN beyond the Mott transition

Abstract: We present a study of germanium as n-type dopant in wurtzite GaN films grown by plasma-assisted molecular-beam epitaxy, reaching carrier concentrations of up to 6.7×10 20 cm -3 at 300 K, well beyond the Mott density. The Ge concentration and free carrier density were found to scale linearly with the Ge flux in the studied range. All the GaN:Ge layers present smooth surface morphology with atomic terraces, without trace of pits or cracks, and the mosaicity of the samples has no noticeable dependence on the Ge c… Show more

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Cited by 43 publications
(48 citation statements)
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“…Despite the high free-electron concentration achieved by these techniques, the minimum resistivity of the GaN films remains high (0.3-0.4 mΩ cm) at electron concentrations of ∼2 × 10 20 cm 3 , 2,3 and the resistivity increases with increasing dopant concentration. 3,5 This behavior is likely caused by a decrease in the electron mobility due to diminished doping efficiency and/or by a degradation in material quality; in either case, this behavior prevents us from understanding the intrinsic electron transport properties of degenerate GaN. Hence, the development of a growth technique that offers high electron mobility as well as high carrier density should be highly sought after.…”
mentioning
confidence: 99%
“…Despite the high free-electron concentration achieved by these techniques, the minimum resistivity of the GaN films remains high (0.3-0.4 mΩ cm) at electron concentrations of ∼2 × 10 20 cm 3 , 2,3 and the resistivity increases with increasing dopant concentration. 3,5 This behavior is likely caused by a decrease in the electron mobility due to diminished doping efficiency and/or by a degradation in material quality; in either case, this behavior prevents us from understanding the intrinsic electron transport properties of degenerate GaN. Hence, the development of a growth technique that offers high electron mobility as well as high carrier density should be highly sought after.…”
mentioning
confidence: 99%
“…The strain that remains after growth is around εxx = 0.12±0.04% (see ref. [1] for a statistical analysis) and increases with the Al mole fraction of the layers, as illustrated in Fig. 2(a To gain further insight on the nature of such Ge-rich areas, EDS/SEM studies of the samples with the highest Ge concentration have been performed.…”
Section: Resultsmentioning
confidence: 99%
“…Although silicon has long been the preferred n-type dopant for AlGaN, germanium is currently under consideration, particularly in those applications that require dopant concentrations around or higher than 10 19 cm −3 [1][2][3][4]. In the case of AlGaN planar layers, high Si doping levels contribute to edge-type dislocation climb and induce tensile stress [4][5][6][7], which leads to a degradation of the surface morphology and favors crack propagation.…”
Section: Introductionmentioning
confidence: 99%
“…This result was attributed to the replacement of Si doping by Ge [11]. In planar layers, Ge has demonstrated the possibility of obtaining high dopant concentrations, above the Mott density (10 À19 cm À3 ), without surface roughening or crack propagation [12][13][14].…”
Section: The Three-dimensional Confinement Of Carriers In Nwmentioning
confidence: 99%
“…This result was attributed to the replacement of Si doping by Ge . In planar layers, Ge has demonstrated the possibility of obtaining high dopant concentrations, above the Mott density (10 −19 cm −3 ), without surface roughening or crack propagation . Recently the conductivity studies in NWs , and observation of screening of the internal electric fields due to Ge incorporation in NW heterostructures have been demonstrated .…”
Section: Introductionmentioning
confidence: 99%