Generalized Thermal Optimization Method for the Plate-Fin Heat Sinks of High Lumen Light Emitting Diode Arrays

Abstract

The performance of high-lumen light-emitting diode (LED) arrays is strongly affected by high temperatures. For better performance, the design of better thermal management techniques is required. In this work, an analytical thermal optimization algorithm for the passive heat sinks of high-lumen LED arrays is presented. With the aid of this algorithm, a broader range of heat sink geometry alternatives can be explored for the identification of the optimal heat sink design. This task is challenging using experimental or numerical techniques. The results demonstrate that the algorithm yields design with a reduction of more than 30% in base temperatures compared to previous heat sink design studies when minimum mass and maximum total efficiency constraints are applied. For devices with high powers, small chip spacing, and space limitations in the horizontal axis where base temperatures cannot be further reduced using these constraints, minimum temperature optimization can result in up to a 17% reduction in base temperatures. This reduction in base temperatures significantly improves the junction temperatures and the overall lighting quality of the LEDs.