2011
DOI: 10.1049/iet-opt.2010.0068
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Generic foundry model for InP-based photonics

Abstract: Similarities and differences between photonic and microelectronic integration technology are discussed and a vision of the development of InP-based photonic integration in the coming decade is given

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Cited by 127 publications
(75 citation statements)
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“…It should also enable the use of multiple antenna system that would lead to advanced active array antennas to compensate the path loss and allow for some tracking. It is interesting to see that photonic integration is now progressing fast in the world with a multi-wafer foundry platform system in Europe 72 and a large research investment in American institutes for manufacturing integrated photonics 73 . These have led to important progresses for the field of THz communications with highlights such as the development of a single chip transmitter (Fig.…”
Section: Future Prospect and Challengesmentioning
confidence: 99%
“…It should also enable the use of multiple antenna system that would lead to advanced active array antennas to compensate the path loss and allow for some tracking. It is interesting to see that photonic integration is now progressing fast in the world with a multi-wafer foundry platform system in Europe 72 and a large research investment in American institutes for manufacturing integrated photonics 73 . These have led to important progresses for the field of THz communications with highlights such as the development of a single chip transmitter (Fig.…”
Section: Future Prospect and Challengesmentioning
confidence: 99%
“…Indium phosphide (InP) based technology allows fabrication of photonic integrated circuits, comprising nowadays even hundreds of components, both active and passive, monolithically integrated on a single semiconductor chip [7]. Advanced epitaxy, deposition and etching techniques enable accurate, submicron definition of the 3-D geometry of the photonic structures.…”
Section: Fabrication Technologymentioning
confidence: 99%
“…Los bloques estándares son provistos por las plataformas genéricas y utilizando software de diseño y simulación, se pueden crear nuevos circuitos. Los PICs provenientes de diferentes diseñadores, usando la misma plataforma pueden compartir el proceso de fabricación común en una ronda denominada MPW (Multi-Project Wafer), con calidad confiable y reducción de costos [8]. Hay varios grupos de investigación trabajando en PICs [9]- [12].…”
Section: Introducción Los Generadores De Frecuencias óPticas (Ofcgunclassified