2014
DOI: 10.2528/pier14022001
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GENERIC INP-BASED INTEGRATION TECHNOLOGY: PRESENT AND PROSPECTS (Invited Review)

Abstract: Abstract-The generic foundry approach will lead to a revolution in micro and nanophotonics, just as it did in microelectronics thirty years ago. Generic integration leads to a drastic reduction in the entry costs for developing Photonic Integrated Circuits. Integrated circuits using generic integration open up a whole new range of applications including data communications, fiber-to-the-home, fiber sensors, gas sensing, medical diagnostics, metrology and consumer photonics. Present status and prospects of InP-… Show more

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Cited by 19 publications
(8 citation statements)
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“…The under testing chip design of the AAC was made using the BB available from 'Application Specific PIC' foundries [19] and proprietary BB created and simulated by the authors.…”
Section: Architecture Of the Couplermentioning
confidence: 99%
“…The under testing chip design of the AAC was made using the BB available from 'Application Specific PIC' foundries [19] and proprietary BB created and simulated by the authors.…”
Section: Architecture Of the Couplermentioning
confidence: 99%
“…/ measure the ring PTR; / calculate the round trip loss from the first equation in (3) (or through Fig. 3(b)); / calculate the propagation loss: ¼ Àð1=LÞ Á ln 2 =I 2 Â Ã ; / calculate Á I through (5). Also the imbalance of the MMI coupler plays a role in the measurement accuracy.…”
Section: Single Notch Ring Configurationmentioning
confidence: 99%
“…Their applications range from communication technologies [1] and sensing [2] to medical diagnostics [3]. The application of the generic foundry model in photonics has radically reduced the effort to design and fabricate a Photonic IC [4], [5], but new bottle-necks at the test phase are emerging.…”
Section: Introductionmentioning
confidence: 99%
“…With the emergence of generic InP-based foundry processes photonic integrated circuits (PICs) have been made accessible to a wide range of users for plenty of applications [1]. The ability to integrate active and passive components monolithically on a single substrate combined with the generic approach to PIC design and fabrication allows for scalable, high density, high performance single chip solutions at a moderate cost [2], [3]. Tunable lasers and fast modulators have always been essential components in many PIC designs not only for the telecom and datacom areas but also in other fields such as microwave photonics or optical sensing.…”
mentioning
confidence: 99%