Genetic algorithm optimization in discrete element simulation of electric parts separation from printed circuit board

Ueda, Takao; Katagiri, Jun; Oki, Tatsuya; Koyanaka, Shigeki

doi:10.1007/s00158-021-02982-4

Cited by 6 publications

(4 citation statements)

References 26 publications

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“…59,66,78,96 As shown in Table 4, most of the methods have certain drawbacks leading to their industrial inefficiency. Some researchers 97 conducted a series of simulations of the WPCB disassembly process using a combination of the genetic algorithm (GA) and discrete element method (DEM) to evaluate the effects of various disassembly techniques on the nondestructive peeling of ICs. The simulations found that although the water jet method, which is not destructive to IC chips, does not completely achieve the separation of ICs from the substrate, the mechanical impact method is used to dislodge the ECs by deforming the substrate.…”

Section: Theoretical Basis For Reuse Of Ecs From Wpcbsmentioning

confidence: 99%

“…It has been used in recycling of WPCBs because its flexible chain can reduce excessive damage to ECs during disassembly. 117 Ueda et al 97 found that a CFS mainly deforms the substrate using mechanical force to disassemble ECs. In particular, by designing experiments, the researchers 118 found that adding screens to the sidewalls and bottom of a CFS would reduce the possibility of over-crushing the samples and improve the reusability of the ECs.…”

Section: Current Status and Development Trends Of Ec Reuse Researchmentioning

confidence: 99%

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The reuse of electronic components from waste printed circuit boards: a critical review

Zhao

Fei

et al. 2023

Environ. Sci.: Adv.

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Section: Theoretical Basis For Reuse Of Ecs From Wpcbsmentioning

confidence: 99%

Section: Current Status and Development Trends Of Ec Reuse Researchmentioning

confidence: 99%

The reuse of electronic components from waste printed circuit boards: a critical review

Zhao

Fei

et al. 2023

Environ. Sci.: Adv.

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“…The optimization method by Balevicius et al 14 is different from the optimum design method in this study. Literature regarding the optimum design method using the DEM as the physical simulation is limited to some previous studies 15,16 . However, their study used a two dimensional (2D) DEM in the optimum design analysis.…”

Section: Original Papermentioning

confidence: 99%

Optimum Design Using Genetic Algorithm and Discrete-element Method: Application to Vibration Feeder Design for E-waste Recycling Automation

Katagiri

Koyanaka

Hayashi

et al. 2023

RESOURCES PROCESSING

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This study is an engineering application of an optimum design approach using the discrete ele ment method (DEM) and a genetic algorithm (GA) which is one of the most commonly used evolu tionary computation algorithms. The threedimensional shapes of waste electrical and electronic equipment (WEEE) were directly applied in a DEM simulation. The DEMGA simulation was ap plied to design the tray set on a singleitem feeder for recycling WEEEs; as a result, we obtained the leftright asymmetrical tray shape. Moreover, unlike conventional symmetrical trays, the asymmetri cal shape induced complex side forces to prevent clogging and to untangle any clogs that had formed. We manufactured a zigzag type asymmetrical tray and examined its feeding performance. Finally, we confirmed that the asymmetrical tray was more effective to prevent the feeding stop when com pared to the symmetrical tray.

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“…Methods for eliminating solder joint connections include using a grinder to remove the solder joints from the back of PCBs [30], using a crossflow shredder to achieve nondestructive detachment of electrical parts from PCBs [31], and using underwater explosion [32] and water jet [33]. Chemical reagents can also be used to dissolve solder joints [34].…”

Section: Introductionmentioning

confidence: 99%

Research on the Disassembly Process and Model of Waste Mobile Phone Circuit Board Components

Jiang

Zhao

et al. 2023

Processes

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Dismantling the waste printed circuit boards (WPCBs) of obsolete mobile phones is essential for resource recycling and environmental protection. An automated WPCB disassembly equipment based on the hot-vibration process was designed and applied, with optimized process conditions of a heating temperature of 250 °C and an equipment amplitude of >3.66 mm. The dismantling rate for electronic components and metal shields was 98%, but disassembly of components with underfill was less effective. Both simulation and actual measurement results of the equipment’s thermal field showed that the temperature inside the disassembly bin was uniform, with a maximum temperature difference of 6–8 °C. The area of the low-temperature region accounted for approximately 5% of the total area. The acceleration ranged from 2.11 to 8.28 g when using the disassembly force model. This equipment and process can be applied to disassemble large quantities of WPCBs.

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Genetic algorithm optimization in discrete element simulation of electric parts separation from printed circuit board

Cited by 6 publications

References 26 publications

The reuse of electronic components from waste printed circuit boards: a critical review

The reuse of electronic components from waste printed circuit boards: a critical review

Optimum Design Using Genetic Algorithm and Discrete-element Method: Application to Vibration Feeder Design for E-waste Recycling Automation

Research on the Disassembly Process and Model of Waste Mobile Phone Circuit Board Components

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