Geometric Simulation of Infeed Grinding Process of Silicon Wafer Using GPU

Inui, Masatomo; Ebina, Yutaro; Maezaki, Tomohiro; Zhou, Libo

doi:10.1109/coase.2018.8560519

Cited by 1 publication

(1 citation statement)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The effect of TTV control is closely related to the grinding tool configuration design [20]. Sun et al [11] established the mathematic model to analyze how grinding tool configuration affected TTV shape components, and then proposed an optimized grinder configuration in terms of an easier operation for spindle angle adjustment, through which the "crosstalking" effect between the two TTV components could be eliminated.…”

Section: Introductionmentioning

confidence: 99%

An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process

et al. 2022

View full text Add to dashboard Cite

The wafer backside grinding process has been a crucial technology to realize multi-layer stacking and chip performance improvement in the three dimension integrated circuits (3D IC) manufacturing. The total thickness variation (TTV) control is the bottleneck in the advanced process. However, the quantitative analysis theory model and adjustment strategy for TTV control are not currently available. This paper developed a comprehensive simulation model based on the optimized grinding tool configuration, and several typical TTV shapes were obtained. The relationship between the TTV feature components and the spindle posture was established. The linear superposition effect of TTV feature components and a new formation mechanism of TTV shape were revealed. It illustrated that the couple variation between the two TTV feature components could not be eliminated completely. To achieve the desired wafer thickness uniformity through a concise spindle posture adjustment operation, an effective strategy for TTV control was proposed. The experiments on TTV optimization were carried out, through which the developed model and TTV control strategy were verified to play a significant role in wafer thickness uniformity improvement. This work revealed a new insight into the fine control method to the TTV optimization, and provided a guidance for high-end grinding tool and advanced thinning process development.

show abstract

Section: Introductionmentioning

confidence: 99%