Giant Magnetostriction of Fe3.2Tb Alloy Film Deposited on Polyurethane Rubber Substrate

Abstract

Magnetostriction and its susceptibility of Fe 3.2 Tb alloy thin film deposited on polyurethane rubber substrate with low deformation resistance by using direct current magnetron sputtering process were investigated. When both residual gas pressure before argon sputtering and sputtering pressure of argon gas (5 N) were less than 5.0×10 -4 Pa and 2.0×10 -1 Pa, respectively, the thickness of the Fe 3.2 Tb films deposited was about 2.96 mm. The giant magnetostriction was found in the Fe 3.2 Tb alloy film on polyurethane rubber sheet, rather than on other polymer sheets. Giant motion strain of Fe 3.2 Tb alloy film largely depended on deformation resistance of substrate. (Received December 25, 2007; Accepted March 18, 2008) Keywords: magnetostriction, susceptibility, mover film, terbium, iron, direct current magnetron sputtering 緒 言

Polyurethane and rare-earth materials: a review

“…Zhang et al, 2022;Xu et al, 2018;Garcia-Torres et al, 2014;Reisfeld et al, 2009;Reisfeld, 2004) Gadolinium (Gd) (Cai et al, 2020;Fiedler et al, 2007;X. Gao et al, 2022) Terbium (Tb) (Fiedler et al, 2007;Hilder et al, 2008;Reisfeld, 2004;Reisfeld et al, 2003;Rong et al, 2020;Ryszkowska et al, 2007;Su, Zhang, Jia, Gao, Li, Bai, et al, 2019;Suenaga et al, 2008;Sun et al, 2010;Villagra et al, 2021;J. Wang et al, 2013;Xi et al, 2017;Yang et al, 2022;W.…”

“…Yang et al (2022) have contributed to the study of the application of lanthanides as an additive for resistance to degradation by UV radiation, which is attributed to the fluorescence property that terbium compounds possess. Suenaga et al (2008) coated PU with an iron-terbium alloy, analyzing how the material deforms when subjected to a magnetic field. The authors concluded that the sample has a high susceptibility to deformation due to the inherent flexibility of PU.…”

Thermal conductivity of diamond particle dispersed aluminum matrix composites fabricated in solid–liquid co-existent state by SPS

“…High-performance thermal management materials should have high thermal conductivities [1][2][3] and low coefficients of thermal expansion (CTEs) for maximizing heat dissipation and minimizing thermal stress and warping, which are critical issues in packaging of microprocessors, power semiconductors, high-power laser diodes, light-emitting diodes (LEDs), and micro-electro-mechanical systems (MEMs) [4][5][6][7]. Thermal stress and warping arise from CTE differences, which become significant in advanced electronic devices because of high heat generated, for example, when highpower laser diodes or high integration level of ICs are in use.…”