Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits

Vanna-Iampikul, Pruek; Zhu, Lingjun; Erdogan, Serhat; Kathaperumal, Mohanalingam; Agarwal, Ravi; Gupta, Ram; Rinebold, Kevin; Lim, Sung Kyu

doi:10.1109/dac56929.2023.10247949

2023 60th ACM/IEEE Design Automation Conference (DAC) 2023

DOI: 10.1109/dac56929.2023.10247949

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Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits

Pruek Vanna-Iampikul,

Lingjun Zhu,

Serhat Erdogan

et al.

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Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits

Cited by 1 publication

References 9 publications

Heterogeneous Integration Technologies for Artificial Intelligence Applications

Heterogeneous Integration Technologies for Artificial Intelligence Applications

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