Gold/tin soldering of flexible silicon chips onto polymer tapes

Hungar, Kaspar; Mokwa, W.

doi:10.1088/0960-1317/18/6/064002

Cited by 8 publications

(8 citation statements)

References 13 publications

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“…In the second example, we demonstrate that dissimilar nanowires can be welded together, using a third material as solder. SnAu alloy solder, widely used in macroscopic welding technique due to its excellent conductivity, low melting point, and large corrosion resistance, 25 is specifically chosen to result in an ultralow electrical resistance join between nanowires. The ability to integrate functional nanowires into circuits via high-performance welded joins represents a significant advance for nanoscale sensor development.…”

mentioning

confidence: 99%

Bottom-up Nanoconstruction by the Welding of Individual Metallic Nanoobjects Using Nanoscale Solder

Peng¹,

Cullis²,

Inkson³

2009

Nano Lett.

148

108

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We report that individual metallic nanowires and nanoobjects can be assembled and welded together into complex nanostructures and conductive circuits by a new nanoscale electrical welding technique using nanovolumes of metal solder. At the weld sites, nanoscale volumes of a chosen metal are deposited using a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. We demonstrate by welding both similar and dissimilar materials that the use of nanoscale solder is clean, controllable, and reliable and ensures both mechanically strong and electrically conductive contacts. Nanoscale weld resistances of just 20Omega are achieved by using Sn solder. Precise engineering of nanowelds by this technique, including the chemical flexibility of the nanowire solder, and high spatial resolution of the nanowelding method, should result in research applications including fabrication of nanosensors and nanoelectronics constructed from a small number of nanoobjects, and repair of interconnects and failed nanoscale electronics.

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confidence: 99%

Bottom-up Nanoconstruction by the Welding of Individual Metallic Nanoobjects Using Nanoscale Solder

Peng¹,

Cullis²,

Inkson³

2009

Nano Lett.

148

108

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“…Furthermore, temperatures required for melting solder are typically higher than the degradation or melting temperature of the polymers previously discussed, with the exception of polyimide and OSTE+ [ 61 ]. Polyimide has been shown to be amenable to solder of various alloys [ 81 , 156 , 157 ] (see Figure 7 for an example of device packaging through soldering).…”

Section: Packagingmentioning

confidence: 99%

Flexible, Penetrating Brain Probes Enabled by Advances in Polymer Microfabrication

2016

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The acquisition of high-fidelity, long-term neural recordings in vivo is critically important to advance neuroscience and brain–machine interfaces. For decades, rigid materials such as metal microwires and micromachined silicon shanks were used as invasive electrophysiological interfaces to neurons, providing either single or multiple electrode recording sites. Extensive research has revealed that such rigid interfaces suffer from gradual recording quality degradation, in part stemming from tissue damage and the ensuing immune response arising from mechanical mismatch between the probe and brain. The development of “soft” neural probes constructed from polymer shanks has been enabled by advancements in microfabrication; this alternative has the potential to mitigate mismatch-related side effects and thus improve the quality of recordings. This review examines soft neural probe materials and their associated microfabrication techniques, the resulting soft neural probes, and their implementation including custom implantation and electrical packaging strategies. The use of soft materials necessitates careful consideration of surgical placement, often requiring the use of additional surgical shuttles or biodegradable coatings that impart temporary stiffness. Investigation of surgical implantation mechanics and histological evidence to support the use of soft probes will be presented. The review concludes with a critical discussion of the remaining technical challenges and future outlook.

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“…Only methods for ultrathin wafer processing that require limited transfers between the wafer carriers can provide reliable operations with high throughput at low production cost. Consequently, a process called ''Dicing-By-Thinning'' or ''Dicing-Before-Grinding'' was suggested [4,[16][17][18][19] in which halfcut dicing is carried out on the wafer's front side before thinning. After bonding to a handle wafer or backgrinding tape, the half-diced wafer is thinned by backgrinding until trenches are opened and dice separated.…”

Section: Wafer Dicingmentioning

confidence: 99%