Grain boundary phase transformation in Cu–Co solid solutions

Zhevnenko, S. N.; Gershman, Evgeny I.

doi:10.1016/j.jallcom.2011.12.027

Cited by 18 publications

(10 citation statements)

References 15 publications

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“…The DSC curves for CG and UFG Cu-Co alloys ( Figure 3c) contain a pronounced additional peak for all samples at around T = 1070 • C (also denoted by crosses in the single-phase region of the Cu-Co phase diagram, Figure 2c). both DSC curves correspond to the precipitates of the second phase (Co) as evidenced indirectly by the data obtained in Reference [164].…”

Section: Resultssupporting

confidence: 63%

“…DSC curves in Figure 3 have a complex shape with overlapping peaks. We used the standard procedure for the quantification of the DSC curves [164] (these procedures are also included in the quantification of the software of modern DSC equipment). According to this approach, the position of the deep minimum (peak) corresponds to the melting temperature, i.e., the liquidus temperature in the bulk phase diagram.…”

Section: Resultsmentioning

confidence: 99%

“…The respective hypothetical line of such transition is also drawn in Figure 2d. Zhevnenko et al studied the creep of the Cu-Co solid solutions close to the bulk solidus [164,[217][218][219]. Zhevnenko et al found a sudden break in the temperature dependences of creep rate even lower than the DSC points shown by crosses in Figure 2d.…”

Section: Discussionmentioning

confidence: 99%

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Grain Boundary Complexions and Phase Transformations in Al- and Cu-Based Alloys

Kogtenkova

Straumal

Korneva

et al. 2018

Metals

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High-pressure torsion has been used to obtain the ultra-fine grained (UFG) state with a high specific area of grain boundaries (GBs) in Al-Zn, Al-Mg, Cu-Ag, Cu-Co, and Cu-Ni solid solutions with face-centered cubic (fcc) lattices. The UFG samples were heated in a differential scanning calorimeter (DSC). Small endothermic peaks in the DSC curves were observed in the one-phase solid-solution area of the respective phase diagrams, i.e., far away from the bulk solidus and solvus lines. A possible explanation of these endothermic peaks is based on the hypothesis of phase transformations between GB complexions. This hypothesis has been supported by observations with transmission electron microscopy and electron backscattering diffraction. The new lines of GB phase transformations have been constructed in the Al-Zn, Al-Mg, Cu-Ag, Cu-Co, and Cu-Ni bulk phase diagrams.

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Section: Resultssupporting

confidence: 63%

Section: Resultsmentioning

confidence: 99%

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Grain Boundary Complexions and Phase Transformations in Al- and Cu-Based Alloys

Kogtenkova

Straumal

Korneva

et al. 2018

Metals

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“…The decreased strength of polycrystalline materials at high temperatures is considered to be attributed to the grain boundary motion, which is thermally activated with the models of grain boundary migration [1,2] , grain rotation [3,4] or grain boundary transformation [5] . The grain boundary motion at high temperatures is actually the intragranular diffusivity of atoms from one site to different sites or intergranular diffusivity of atoms from one grain to the adjacent ones, which finally results in the decreased strength of polycrystalline materials at high temperatures.…”

Section: Introductionmentioning

confidence: 99%

Improved high temperature strength of copper-graphene composite material

Wang

2016

Materials Letters

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The strength of polycrystalline materials at high temperatures is limited due to their poor resistance to grain boundary motion. A strategy to anchor the grain boundary of copper in 2-dimensional curvature by graphene was proposed and the copper-graphene composite was therefore fabricated. It was found that the hardness of Cu-0.5 wt% graphene (GN) composite is almost same with that of Cu-0.5 wt% graphite (GP) composite between room temperature and 450 C. However, the hardness of Cu-GN composite improves significantly above 450 C and is nearly twice of that of Cu-GP composite at 600 C, indicating the hindrance effect of grphene on the atom diffusion across grain boundary at high temperatures. On the other hand, the thermal expansion coefficient is lower for Cu-GN composite compared with that of Cu-GP composite, and the electrical conductivity of the Cu-0.5wt% GN composite remains 95.9 IACS%.

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“…According to data received in [14] by the zero-creep method, the surface tension for the system Cu-1.45% Co grows from 1.78 (pure Cu) to 1.91 N/m. Such large increase of s is impossible to explain in the model of regular solutions.…”

Section: Discussionmentioning

confidence: 99%