“…The low strain hardening and strain softening observed in the Cu-24% Ta specimens are typical of nanostructured and nanocrystalline materials [65,66,67] because nanocrystalline grains are inherently unable to accumulate dislocations, unless dislocation motion can be obstructed through pinning, tangling, or locking [68]. Rather, in nanocrystalline materials, grain boundary dislocation emission and absorption occur readily because of the high number density of grain boundaries [69,70,71,72], leading to deformation by grain boundary sliding and migration [73,74,75,76,77] or grain rotation [72,78,79,80,81,82,83]. Similarly, micropillar compression and nanoindentation studies of Al/Al 3 Sc [84], Al/Nb [85], Cu/Zr [86], and Cu/Nb [87,88] nanolayers exhibit strain softening when nanolayer thicknesses are on the order of a few tens of nm.…”