Grain-boundary sliding in nanocrystalline fcc metals

Swygenhoven, H. Van; Derlet, P. M.

doi:10.1103/physrevb.64.224105

Cited by 532 publications

(305 citation statements)

References 26 publications

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“…8 Below this critical grain size, MD simulations have shown that GB sliding becomes the dominant deformation mechanism, 179 giving rise to grain rotation, in agreement with some experimental observations. 180 Furthermore, Van Swygenhoven and Derlet 181 have shown that GB sliding is triggered by atomic shuffling and stressassisted free volume migration from triple junctions; the emission of dislocations from GBs was limited. In addition, three-dimensional nanocrystalline materials that undergo grain rotation have also displayed the inverse Hall-Petch response.…”

Section: Nanocrystalline MD Simulationsmentioning

confidence: 99%

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

Tschopp

Murdoch

Kecskes

et al. 2014

JOM

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It is a new beginning for innovative fundamental and applied science in nanocrystalline materials. Many of the processing and consolidation challenges that have haunted nanocrystalline materials are now more fully understood, opening the doors for bulk nanocrystalline materials and parts to be produced. While challenges remain, recent advances in experimental, computational, and theoretical capability have allowed for bulk specimens that have heretofore been pursued only on a limited basis. This article discusses the methodology for synthesis and consolidation of bulk nanocrystalline materials using mechanical alloying, the alloy development and synthesis process for stabilizing these materials at elevated temperatures, and the physical and mechanical properties of nanocrystalline materials with a focus throughout on nanocrystalline copper and a nanocrystalline Cu-Ta system, consolidated via equal channel angular extrusion, with properties rivaling that of nanocrystalline pure Ta. Moreover, modeling and simulation approaches as well as experimental results for grain growth, grain boundary processes, and deformation mechanisms in nanocrystalline copper are briefly reviewed and discussed. Integrating experiments and computational materials science for synthesizing bulk nanocrystalline materials can bring about the next generation of ultrahigh strength materials for defense and energy applications.

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Section: Nanocrystalline MD Simulationsmentioning

confidence: 99%

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

Tschopp

Murdoch

Kecskes

et al. 2014

JOM

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“…The important role of excess volume associated with interfaces has also been found in studies on dynamic grain boundary behaviour. In a molecular dynamics study on grain boundary sliding in nano-crystalline material, it was found that atomic level shuffling and stress-assisted free-volume migration play an important role in the plastic deformation process occurring at the GB region [16], and, on the basis of a molecular dynamics study on a Σ = 5 tilt GB in fcc material, it was found that excess volume is the key to both components of the migration mechanism (local volume fluctuations and atomic hops perpendicular to the boundary plane) [10].…”

Section: Interface Mobilitymentioning

confidence: 99%

Atomistic study on the activation enthalpies for interface mobility and boundary diffusion in an interface-controlled phase transformation

Bos

Sommer

Mittemeijer

2007

Philosophical Magazine

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“…[42,43] Conrad and Narayan [44] have used these results by proposing that during the deformation of nc materials, the controlling process is a stress-assisted thermally activated motion in the grain boundary in which the deformation rate is produced by independent atomic shear events (atomic jump processes). Under this condition, they developed the following rate-controlling equation: [44] …”

Section: Thermally Activated Grain Boundary Shearing Processmentioning

confidence: 99%

“…Van Swygenhoven et al [42,43] have proposed that during the deformation of nc Ni, plasticity arises from grains sliding against each other under the condition of nonlinear-viscous behavior. The equation representing such sliding behavior can be given by [42,43] …”

Section: Boundary Sliding Under the Condition Of Nonlinear-viscous Bementioning

confidence: 99%

“…For a computer-modeled Ni, [42] v is approximately b 3 and U = 19.22 kJ/mol (0.2 eV). The model by Swygenhoven et al [42,43] represents the first attempt to describe the deformation of nc materials in terms of a thermally activated process that incorporates the effect of grain size. However, there are three problems regarding the validity of this model, as represented by Eq.…”

Section: Boundary Sliding Under the Condition Of Nonlinear-viscous Bementioning

confidence: 99%

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Deformation Mechanisms in Nanocrystalline Materials

Mohamed

Yang

2009

Metall Mater Trans A

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As a result of recent investigations on nanocrystalline (nc) materials, extensive experimental data on the deformation behavior of these materials have become available. In this article, an analysis of these data was performed to identify the requirements that a viable deformation mechanism should meet in terms of accounting for the mechanical characteristics and trends that are revealed by the data. The results of the analysis show that a viable deformation mechanism is required to account for the following: (1) an activation volume the value of which is in the range 10 to 40 b 3 ; (2) an activation energy that is close to the activation energy for boundary diffusion but that decreases with increasing applied stress; (3) the magnitudes of deformation rates that cover wide ranges of temperatures, stresses, and grain sizes; (4) inverse Hall-Petch behavior; and (5) limited ductility. The validity of available deformation mechanisms for nc materials is closely examined in the light of these requirements.

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Grain-boundary sliding in nanocrystalline fcc metals

Cited by 532 publications

References 26 publications

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

Atomistic study on the activation enthalpies for interface mobility and boundary diffusion in an interface-controlled phase transformation

Deformation Mechanisms in Nanocrystalline Materials

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