2022
DOI: 10.1016/j.ijfatigue.2021.106614
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Grain reorientation and stress-state evolution during cyclic loading of an α-Ti alloy below the elastic limit

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Cited by 8 publications
(1 citation statement)
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“…A similar behaviour can be observed in the case of materials subjected to long-term annealing at elevated temperatures [58] or materials exposed to cyclic thermal changes. [59] For example, as reported by Yeadon, [60] the adjustment of the crystallographic lattice orientation in the interface region was obtained during the sintering of copper powder directly on a copper substrate. The reorientation process was caused by a surface diffusion mechanism accompanying the neck formation and their growth and additionally by the migration of the grain boundary through the individual particles.…”
Section: Grain Sizementioning
confidence: 96%
“…A similar behaviour can be observed in the case of materials subjected to long-term annealing at elevated temperatures [58] or materials exposed to cyclic thermal changes. [59] For example, as reported by Yeadon, [60] the adjustment of the crystallographic lattice orientation in the interface region was obtained during the sintering of copper powder directly on a copper substrate. The reorientation process was caused by a surface diffusion mechanism accompanying the neck formation and their growth and additionally by the migration of the grain boundary through the individual particles.…”
Section: Grain Sizementioning
confidence: 96%