Grain size effect on indentation of nanocrystalline copper

Huang, Chao-Chun; Chiang, Tsung-Cheng; Fang, Te‐Hua

doi:10.1016/j.apsusc.2015.06.135

Cited by 51 publications

(18 citation statements)

References 31 publications

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“…Using MD simulations, we observed a stress-enhanced grain growth in quasi-two-dimensional (2D) nanocrystalline Cu, with a grain size of <5 nm, at 300 K in a nanoindentation process [23]. We performed uniaxial tensile tests on a quasi-2D thin film of nanocrystalline Cu with grain sizes varying from 3 nm to 8 nm.…”

Section: Introductionmentioning

confidence: 98%

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Effects of grain size and temperature on mechanical response of nanocrystalline copper

Fang

Huang

Chiang

2016

Materials Science and Engineering: A

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Section: Introductionmentioning

confidence: 98%

“…Recently, Wang et al [19] observed that grain rotation becomes the most prevalent mode at a grain size of o6 nm. The deformation-induced grain rotation and grain growth have been evaluated using MD simulations [20][21][22][23] and theoretical model calculations [24,25].…”

Section: Introductionmentioning

confidence: 99%

Effects of grain size and temperature on mechanical response of nanocrystalline copper

Fang

Huang

Chiang

2016

Materials Science and Engineering: A

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“…However, Huang et al [75] only found inverse Hall-Petch effect for grain sizes below 7 nm in nc Cu. In addition they reported stress-induced grain growth as well as grain rotation as the cause for grain coarsening under indentation.…”

Section: Effect Of Surface and Bulk Defects On Plasticitymentioning

confidence: 97%

Atomistic Studies of Nanoindentation—A Review of Recent Advances

2017

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This review covers areas where our understanding of the mechanisms underlying nanoindentation has been increased by atomistic studies of the nanoindentation process. While such studies have been performed now for more than 20 years, recent investigations have demonstrated that the peculiar features of nanoplasticity generated during indentation can be analyzed in considerable detail by this technique. Topics covered include: nucleation of dislocations in ideal crystals, effect of surface orientation, effect of crystallography (fcc, bcc, hcp), effect of surface and bulk damage on plasticity, nanocrystalline samples, and multiple (sequential) indentation. In addition we discuss related features, such as the influence of tip geometry on the indentation and the role of adhesive forces, and how pre-existing plasticity affects nanoindentation.

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“…This is due to an increase in the number of grain boundaries (GBs), which act as barriers against the diffusion of dislocations inside grains (intragranular deformation). However, many simulations [6,7] and experiments [8,9] on the mechanical properties of NC materials have shown that the H-P effect may break down when GS is below about 20 nm [6][7][8][9] because GB-mediated processes, such as GB sliding, migration, and diffusion, gradually dominate the plastic deformation. For GS below the critical value, materials soften with decreasing GS, which is referred to as the inverse H-P effect.…”

Section: Introductionmentioning

confidence: 97%

“…Many nanosystems have been successfully analyzed using MD, such as nanomilling [10], nanowelding [11,12], nanoextrusion [13], and nanotribology of metallic glasses [14]. Huang et al [7] modeled NC Cu under nanoindentation and found that the equivalent stress decreases quickly when GS is smaller than 5 nm. Grain coarsening was attrituded to grain rotation during deformation.…”

Section: Introductionmentioning

confidence: 99%

Atomistic simulation study of tensile deformation in nanocrystalline and single-crystal Au

Tsai

2017

J Mol Model

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The effect of notch size (r) on nanocrystalline (NC) and single-crystal (SC) Au at a temperature of 300 K under tension testing is studied using molecular dynamics simulations based on the many-body embedded-atom potential. The effect is investigated in terms of atomic trajectories, common neighbor analysis, and the stress-strain curve. The simulation results show that for the NC samples, stacking faults nucleate at grain boundaries (GBs), propagate inside grains, and eventually are terminated by GBs or transect them. For tensile-deformed NC and SC samples with larger r values, necking and breaking occur faster, which indicates that ductility decreases. SC samples exhibit larger yield strength and ultimate strength than those of NC samples. SC samples have a longer elastic deformation period due to their lack of GBs. For NC samples, increasing the r value increases Young's modulus but decreases the yield point; in addition, it decreases mechanical strength and speeds up the formation of necking.

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Grain size effect on indentation of nanocrystalline copper

Cited by 51 publications

References 31 publications

Effects of grain size and temperature on mechanical response of nanocrystalline copper

Effects of grain size and temperature on mechanical response of nanocrystalline copper

Atomistic Studies of Nanoindentation—A Review of Recent Advances

Atomistic simulation study of tensile deformation in nanocrystalline and single-crystal Au

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