1975
DOI: 10.1002/pssa.2210270103
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Grain size effects on thermoelectrical properties of sintered solid solutions based on Bi2Te3

Abstract: The dependence of the electrical conductivity and thermoelectric power on the mean grain size in 16% Bi2Se3–84% Bi2Te3 (as n‐type) and 75% Sb2Te3–25% Bi2Te3 (as p‐type) solid solutions is analysed. In p‐type materials, the main process by sintering is the reduction of the contact resistance between grains. In n‐type materials, the changes in carrier concentrations are due to the specific surface of grains.

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Cited by 58 publications
(28 citation statements)
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“…31 The p H of the HD samples is systematically lower than that of the ZM samples because of the donor-like effect. 47,48 The non-basal slip during the deformation processing (typically upon HD) tends to create 3Te-2Bi vacancy-interstitial pairs, 49 and the Bi 0 Te will more readily diffuse back into the Bi sublattice sites; thus, excess Te vacancies and electrons are produced: 47…”
Section: Carrier Concentration and Electrical Propertiesmentioning
confidence: 99%
“…31 The p H of the HD samples is systematically lower than that of the ZM samples because of the donor-like effect. 47,48 The non-basal slip during the deformation processing (typically upon HD) tends to create 3Te-2Bi vacancy-interstitial pairs, 49 and the Bi 0 Te will more readily diffuse back into the Bi sublattice sites; thus, excess Te vacancies and electrons are produced: 47…”
Section: Carrier Concentration and Electrical Propertiesmentioning
confidence: 99%
“…As it is a well-known fact that the hole concentration is created by the antistructure defects generated by the occupation of Te sites with Bi and Sb atoms for the p-type Bi 2 Te 3 -Sb 2 Te 3 solid so- Table 1 Hole concentration (n), mobility (µ) of samples (the applied magnetic field is perpendicular to the crystal growth direction for the zone-melted ingot and parallel to the pressing direction for the sintered samples) lutions, which can be described as: Bi 2 Te 3 = 2Bi Te + 2V Bi + V Te + (3/2)Te 2(g) + 2h; Sb 2 Te 3 = 2Sb Te + 2V sb + V Te + (3/2)Te 2(g) + 2h, where V Te is Te vacancy, V × Bi(Sb) is Bi(Sb) vacancy [15]. Ionescu et al [16] reported that through mechanical treatment, more Te vacancies than Bi(Sb) vacancies are generated mainly due to the nonbasal slip which gives on the average, 3 Te to 2 Bi vacancy-interstitial pairs. Navratil et al [17] proposed an interaction of such vacancies with the antistructure defects, as: 2V Bi(Sb) + 3V Te + Bi(Sb) Te = V Bi(Sb) + Bi(Sb) × Bi(Sb) + 4V Te + 3e , where e is the produced electron, which consequently decreases the hole concentration.…”
Section: Resultsmentioning
confidence: 98%
“…In particular, the fact that p-type stoichiometric Bi2Te3 samples will become n-type when subjected to heavy plastic deformation has been explained via an excess formation of VTe over VBi''' [10,50,51]. Vacancies distort the lattice more strongly than antisites, since their coulombic repulsion is twice (for VTe) or three-times (for VBi''') that of an antisite.…”
Section: Microstrain and Lattice Parameter Changementioning
confidence: 99%