1998
DOI: 10.1016/s1359-6454(97)00348-0
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Grain size influence on residual stresses in alumina/zirconia composites

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Cited by 54 publications
(45 citation statements)
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“…[19] These methods provide accurate residual stress measurements without the need for numerical analysis [e.g., finite element analysis (FEA)] yet require specialized equipment (i.e., synchrotron or neutron sources). Other nondestructive methods include ultrasonics, [20] electrical resistivity, [21] magnetic behavior, [22] and piezo-spectroscopy in thin films [23,24] ; these are material and geometry specific. While these methods are largely used ex situ, X-ray diffraction has been used to evaluate other types of process-induced residual stresses in situ (thin films, [25] welded materials [26] and composites [27] ).…”
Section: B Residual Stress Measurement Methodologiesmentioning
confidence: 99%
“…[19] These methods provide accurate residual stress measurements without the need for numerical analysis [e.g., finite element analysis (FEA)] yet require specialized equipment (i.e., synchrotron or neutron sources). Other nondestructive methods include ultrasonics, [20] electrical resistivity, [21] magnetic behavior, [22] and piezo-spectroscopy in thin films [23,24] ; these are material and geometry specific. While these methods are largely used ex situ, X-ray diffraction has been used to evaluate other types of process-induced residual stresses in situ (thin films, [25] welded materials [26] and composites [27] ).…”
Section: B Residual Stress Measurement Methodologiesmentioning
confidence: 99%
“…At least part of the motivation for the polycrystalline research was to investigate the stress fields arising in polycrystalline alumina responsible for microcracking-the spontaneous localized cracking that occurs in polycrystalline alumina on cooling as a consequence of the anisotropic structure and thermal expansion of corundum [39][40][41]. From the 1990s onward, although there were many notable fundamental studies of the phenomenon [42][43][44][45][46][47][48][49][50][51][52][53][54][55][56][57][58], the shift in energy of R lines with stress was largely confined to the applied domain, detailed in numerous works, such as: measurement of stress in bulk Al2O3 polycrystals [42,[58][59][60][61][62][63][64][65][66][67]; in bulk Al2O3-ZrO2 composites [68][69][70][71][72][73][74][75][76][77][78]; in sapphire or composite fibers, free or in matrices [79][80]…”
mentioning
confidence: 99%
“…On the other hand, the crystallite (grain) size and the surface roughness of the film are strongly affected by the surface roughness of substrate. Note that the variation of the former is small (from 34 nm to 46 nm, those difference range may be caused by the residual stress during sputtering [45]), while the later is quite large (from 3 nm to 53 nm). Further, the variation of the average surface roughness (film) and the photocatalytic ability is similar to each other ( Fig.…”
Section: Discussionmentioning
confidence: 99%