Grain structure of thin electrodeposited and rolled copper foils

Merchant, H. D.; Liu, W. C.; Giannuzzi, Lucille A.; Morris, James G.

doi:10.1016/j.matchar.2004.07.013

Cited by 44 publications

(24 citation statements)

References 16 publications

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“…6) and a coarsened grain structure. 4 If these can be tolerated, the upper limit of anneal temperature is defined by the grain size approaching the foil thickness and the appearance of agglomerated pores along the grain boundaries. 4 Both tend to affect the ductility and perhaps the fatigue performance.…”

Section: Discussionmentioning

confidence: 99%

“…3 In turn, this structure has been postulated as being responsible for its anneal response and high-temperature embrittlement. 1 The microstructural evidence 4 indicates that for the R foil, anneal softening occurs by discontinuous recrystallization (nucleation and growth of new grains) over a narrow range of temperatures. For the ED foil, anneal softening appears to occur by in-situ grain growth, the temperature range of softening is readily controlled by the manipulation of deposition parameters.…”

Section: Introductionmentioning

confidence: 99%

“…Under these conditions, the grain boundaries become aligned along the foil thickness. 4 The primary use of free-standing, thin copper foil is in the electronic packaging area, specifically for flexible and rigid printed circuits. Rather than using the laboratory-prepared foil samples, the 35-µm, commercial-grade ED and R foils are examined.…”

Section: Introductionmentioning

confidence: 99%

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Thermal effects in thin copper foil

Merchant¹

2004

Journal of Elec Materi

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The anneal response and high-temperature ductility for four commercialgrade 35-µm rolled (R: GR5) and electrodeposited (ED: GR1, GR3, and TCAM) copper foils, used for rigid and flexible printed circuits, are investigated. Using tensile and microhardness monitors, the anneal response is examined to 900°C for up to 300 min, and the high-temperature ductility is characterized to a 200°C test temperature. For comparison, the ED "control" foils, using deposition parameters identical to those for the commercial foils but without the additives usually introduced in the electrolyte, are also examined. The ED control foils thermally soften readily; the temperature range of softening decreases with the electrodeposition overvoltage (η). For the commercial-grade foils, the proprietary additives help tailor thermal softening but cause severe disruption of anneal kinetics (TCAM) and embrittlement at (TCAM) and above (GR1, GR3) 23°C.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Thermal effects in thin copper foil

Merchant¹

2004

Journal of Elec Materi

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“…The first technique consists in moving metal ions contained in an acid solution thanks to an electric field in order to coat an electrode until the desired thickness. This technique is commonly employed in the case of conductive materials like copper [7]. The second one consists in passing a given specimen through a pair of rolls to reduce its thickness until the desired value.…”

Section: Introduction *mentioning

confidence: 99%

Elaboration of Thin Foils in Copper and Zinc by Self-Induced Ion Plating

Giraud¹,

Pace²,

Lecomte-Beckers³

2014

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is an open access repository that collects the work of Arts et Métiers ParisTech researchers and makes it freely available over the web where possible. The aim of this work was to determine the ability to produce thin metallic foils by self-induced ion plating. Foils of pure copper and pure zinc with a thickness of 35 µm have been successfully produced and their characteristics have been compared to foils obtained by conventional techniques (i. e. electroplating and rolling). Results show the following: (i) more or less compact microstructures can be obtained by self-induced ion plating depending on gas pressure and substrate temperature; (ii) microstructures obtained by self-induced ion plating are quite different from those obtained by electroplating and rolling; (iii) Young's modulus depends on foils roughness; (iv) hardness depends on grain size by exhibiting a Hall-Petch behavior in the case of copper foils and an "inverse" Hall-Petch behavior in the case of zinc foils.

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“…The microstructure evolution of copper films can be characterized by several techniques: optical and electron microscopy, [6][7][8][9][10][11] focused ion beam (FIB) imaging, 6,[12][13][14][15] and electron backscatter diffraction (EBSD). 12,16,17) EBSD provides information on the grain size and morphology statistics and grain boundary characteristics, as well as the crystal orientation of the individual grains.…”

Section: Introductionmentioning

confidence: 99%

Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

2010

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The microstructure evolution of electroplated copper films was characterized by electron backscatter diffraction (EBSD). Special care was taken during the preparation of the cross-sectional specimens and microstructure analysis to obtain reliable results. The film exhibited a columnar grain structure with a large fraction of twin boundaries. Annealing induced normal grain growth and caused many of the general highangle grain boundaries to be replaced by twin boundaries, possibly by annealing twinning.

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Grain structure of thin electrodeposited and rolled copper foils

Cited by 44 publications

References 16 publications

Thermal effects in thin copper foil

Thermal effects in thin copper foil

Elaboration of Thin Foils in Copper and Zinc by Self-Induced Ion Plating

Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

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