Graphene nanosheet/silicone composite with enhanced thermal conductivity and its application in heat dissipation of high-power light-emitting diodes

Zhang, Haiyan; Lin, Yixin; Zhang, Danfeng; Wang, Wenguang; Xing, Yuxiong; Jin, Lin; Hong, Haoqun; Li, Chunhui

doi:10.1016/j.cap.2016.10.004

Cited by 30 publications

(12 citation statements)

References 38 publications

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“…The use of graphene and FLG in composites is not limited to thermal management. It is also being utilized for electromagnetic interference (EMI) shielding [84], [99], [103], [108], [125], [198], [199].…”

Section: Commercial Applications Of Graphenementioning

confidence: 99%

Graphene Thermal Interface Materials – State-of-the-Art and Application Prospects

Sudhindra

Ramesh

Balandin

2022

IEEE Open J. Nanotechnol.

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We provide a summary of the fundamentals of thermal management, outline the stateof-the-art in the field of thermal interface materials, and describe recent developments in graphenebased non-curing and curing composites used for thermal management. The discovery of unique heat conduction properties of graphene and few-layer graphene motivated research activities worldwide focused on creating efficient graphene-based thermal interface materials. While the initial focus of these studies was on obtaining the maximum possible thermal conductivity of the composites, recently the attention has shifted to practical problems of minimizing the thermal contact resistance at interfaces, optimizing the size distribution of graphene as filler, and addressing the issues of scalability, stability, and production costs at commercial scales. We conclude the review with a general outlook for commercial applications of graphene in the thermal management of electronics.

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Section: Commercial Applications Of Graphenementioning

confidence: 99%

Graphene Thermal Interface Materials – State-of-the-Art and Application Prospects

Sudhindra

Ramesh

Balandin

2022

IEEE Open J. Nanotechnol.

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“…Using a similar reduced graphene oxide at only 1.5 wt. %and an additional functionalization step, a silicone matrix composite achieved a TC of 2.7 W/mK [10]. This TIM was then applied to bridge an LED chip and a heat sink with a smaller temperature difference between the two when the TIM TC increases.…”

Section: Recent Advances Of Graphene Timsmentioning

confidence: 99%

“…Each of these serve to make improved thermal dissipative solutions increasingly essential. In parallel, the growing fields of LED lighting and solar energy along with continuation of aerospace products all require similar and improved heat dissipation solutions [7][8][9][10][11][12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Review of Graphene-based Thermal Polymer Nanocomposites: Current State of the Art and Future Prospects

Lewis¹,

Perrier²,

Barani³

et al. 2020

Preprint

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We review the current state-of-the-art of graphene-enhanced thermal interface materials for the management of heat the next generation of electronics. Increased integration densities, speed, and power of electronic and optoelectronic devices require thermal interface materials with substantially higher thermal conductivity, improved reliability, and lower cost. Graphene has emerged as a promising filler material that can meet the demands of future high-speed and highpowered electronics. This review describes the use of graphene as a filler in curing and non-curing polymer matrices. Special attention is given to strategies for achieving the thermal percolation threshold with its corresponding characteristic increase in the overall thermal conductivity. Many applications require high thermal conductivity of the composites while simultaneously preserving electrical insulation. A hybrid filler graphene and boron nitride approach is presented as possible technology for independent control of electrical and thermal conduction. Reliability and lifespan performance of thermal interface materials is an important consideration towards the determination of appropriate practical applications. The present review addresses these issues in detail, demonstrating the promise of the graphene-enhanced thermal interface materials as compared to alternative technologies.

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“…Graphene, a two-dimensional hexagonal arrangement of sp 2 -hybridized carbon atoms, has attracted more and more attention in high-efficiency thermal interface materials (TIMs), owing to the ultrahigh in-plane thermal conductivity (∼5000 W(m·k) − 1 ). 12–14 Nevertheless, graphene/polymer-based composites generally have a larger dielectric permittivity and dielectric loss owing to the interface polarization and leakage current caused by the high specific area of graphene. 15,16 Zhang added the solvothermally reduced graphene oxide with the 2 wt% content to the PI, the dielectric permittivity and dielectric loss tangent of composite film were about 30 and 8 at 10 3 Hz, respectively.…”

Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity of polyimide composite film filled with hybrid fillers

Ruiyi

Ding

et al. 2021

High Performance Polymers

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In this article, the polyimide (PI) composite films with synergistically improving thermal conductivity were prepared by adding a few graphene nanoplatelets (GNP) and various hexagonal boron nitride (h-BN) contents into the PI matrix. The thermal conductivity of PI composite film with 1 wt% GNP and 30 wt% h-BN content was 1.21 W(m·k)− 1, which was higher than that of the PI composite film with 30 wt% h-BN content (0.45 W(m·k)− 1), the synergistic efficiency of GNP under various h-BN content (10 wt%, 20 wt%, and 30 wt%) were 1.70, 2.71, and 3.09, respectively. And it was found that the increased h-BN content can suppress the dielectric properties caused by GNP in the matrix. The dielectric permittivity and dielectric loss tangent of 1 wt% GNP/PI composite film were 10.69, 0.661 at 103 Hz, respectively, and that of the 30 wt% h-BN + GNP/PI composite film were 4.29 and 0.1367, respectively. Moreover, the mechanical properties of the PI composite film were suitable for practical applications. And the heat resistance index and the residual rate at 700°C of PI composite film increased to 326.8°C, 74.43%, respectively, and these of PI film were 292.6°C and 59.26%. Thus, it may provide a reference value for applying the filler hybridization/PI film in the electronic packaging materials.

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Graphene nanosheet/silicone composite with enhanced thermal conductivity and its application in heat dissipation of high-power light-emitting diodes

Cited by 30 publications

References 38 publications

Graphene Thermal Interface Materials – State-of-the-Art and Application Prospects

Graphene Thermal Interface Materials – State-of-the-Art and Application Prospects

Review of Graphene-based Thermal Polymer Nanocomposites: Current State of the Art and Future Prospects

Enhanced thermal conductivity of polyimide composite film filled with hybrid fillers

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