Achieving excellent thermal stability, good mechanical strength, and low-density in one product, is a big challenge in the design and synthesis of polyimide (PI) foams. We selected a rigid diamine monomer, 2-(4-aminophenyl)-5-aminobenzoxazole (DAPBO) to partially replace 4,4 0-oxydianiline (ODA) in BTDA-ODA system, and studied the effect on properties of foamed PI products. With various molar ratio between DABPO and ODA (0:5, 1:4, 2:3, 3:2, 4:1, 5:0), the diamine(s) polymerized with 3,3 0 ,4,4 0-benzophenonetetracarboxylic dianhydride (BTDA) and produced six PI precursors (PAE-0~PAE-5). After foaming and thermal imidization, corresponding PI foams (PI-0~PI-5) prepared. Among them, PI-3 has a glass transition temperature of 386 C, which is 95 C higher than PI-0, and its compressive strength reaches 1.32 MPa. Moreover, PI-3 has a uniform cell structure with an average pore size of~200 Îźm. The analysis results show that PI-3 is in a transition state from amorphous to partial crystalline, maintaining a balance between flexibility and rigidity. The addition of DABPO not only increases the rigidity of polymer molecular segments, but also introduces N and O atoms that can form intermolecular hydrogen bonds between molecules, which increases the packing density and arrangement regularity of polymer molecules. K E Y W O R D S DABPO, enhanced thermal stability, high mechanical strength, polyimide foam, powder foaming 1 | INTRODUCTION Foam plastic is a plastic with a large number of micropores manufactured by a foaming process. 1,2 Compared with ordinary plastics, it has lower density, smaller thermal conductivity and higher specific strength. Foam plastic also has the properties of absorbing impact loads, sound absorption, and heat insulation, and is widely used in many fields. 3-6 Polyimide (PI) is a family of polymers with the best overall evaluation among engineering plastics, possessing good thermal stability, insulation, and mechanical properties. 7-12 Monsanto and DuPont conducted the earliest research on PI foam in 1960s. 13 Subsequently, National Aeronautics and Space Administration (NASA) Langley Research Center and Unitika America collaborated on the research of PI foams and promote their commercialization. After foaming, the density of PI can be reduced by more than 90%, meanwhile its glass transition temperature (T g) increases, and thermal conductivity decreases significantly. 14-19 The reduction of weight and increase of strength are the eternal theme of material development, especially in