Graphene/Polyolefin Elastomer Films as Thermal Interface Materials with High Thermal Conductivity, Flexibility, and Good Adhesion

Abstract

Heat dissipation has become a central issue for the development of the microelectronic industry. Thermal interface materials (TIMs) have been widely applied to electron component cooling, which is used to bond the heat spreader and the chip together. Most research on TIMs has only dealt with thermal conductivity enhancement. However, the mechanical properties and adhesion of TIMs are indispensable for practical applications, as well as postcleaning to remove TIMs. A graphene nanosheet/polyolefin elastomer (GNP/POE) film was designed and prepared by a facile method, in which the heat conduction paths were efficiently constructed, and the good mechanical properties of POE were reserved. The thermal conductivity of as-prepared GNP/POE film can reach 1.07 W m −1 K −1 at an extremely low filler loading of 0.62 wt %. Furthermore, the tensile strength, elongation at break, and adhesion of the prepared GNP/POE film are as good as those of commercial TIM productions. The prepared GNP/POE film can be used as TIMs for chip cooling and exhibits a good heat dissipation effect. Additionally, the prepared GNP/POE film can be peeled off from the chip without residue, after the chip has finished running, which is significant for practical production. This work provides valuable information and insight into the design and fabrication of TIMs in the future.

Exploring the Impact of Visual Heat Conduction Paths on Thermal Conductivity of Polymer Composites and the Practical Applications

“…), the crystallization zone of the polyethylene chain is weakened, and an amorphous rubber phase is generated that gives the product surface stickiness. The surface of POE pellets can be encapsulated by BN and Al 2 O 3 fillers through the physical mixing, as well as graphene fillers in previous work, demonstrating that most fillers can be absorbed to the surface of POE pellets, according to the surface stickiness. In Figure B,B1,C,C1, when the POE surface exclusively absorbs BN or Al 2 O 3 , the interfiller gap is substantial, and the height disparity of the surface accumulation is obvious.…”

“…In order to further advance the development of the prepared composite films in practical applications, an integrated composite material was designed and prepared. The adhesion performance of composite films has been tested , as well as the electromagnetic shielding effect of the integrated composite material − because these properties are crucial for the practical application prospects of materials. The BN(2)/Al 2 O 3 (1)@POE particles were evenly distributed on the surface of the functional film first, and the integrated composite material is subsequently prepared through a heating press, as illustrated in Figure A.…”

“…The thermal conductivity, dielectric properties, and mechanical properties for BN/Al 2 O 3 @POE films were investigated yet. The BN/Al 2 O 3 @POE film is an extremely promising material for the preparation of TIMs based on the previous testing results. , The encapsulated POE pellets with BN/Al 2 O 3 fillers were integrated with different functional films (Cu, Al, or graphite) to prepare composite films by a one-pot heating press, and the resulting composite films exhibited good interlayer adhesion and electromagnetic shielding effect. Hence, this study holds significant implications for advancing the theoretical research on heat conduction networks and facilitating the practical application of related materials.…”

“…The PBX particles coated with graphene sheets were subjected to the hot compression molding process to prepare polymer composites . Zhao et al formed graphene nanoplate (GNP) encapsulation on the surface of POE pellets based on the surface tackiness first and then fabricated GNP/POE composite films by a heating press . The heat conduction networks were successfully constructed based on carbon-based sheet fillers in these reports.…”

Patterned liquid metal embedded in brush-shaped polymers for dynamic thermal management

“…4h presents statistical data representing the relationship between the thermal conductivity and elastic modulus of silicone, foams, ceramics, and various polymeric composites enhanced with fillers such as LM, carbon nanotubes, and graphene, among others. 15,19,27,34,37,45,50,59–63 The composite material thus developed, featuring low modulus, high deformability, and high κ , demonstrates pressure-controlled heat dissipation capabilities and dynamic thermal dissipation in complex environments. This surpasses the heat dissipation performance of commercial TIMs, highlighting its potential as a high-performance TIMs for flexible electronics.…”