“…After etching of possible FeCl 3 residues in H 2 O: HCl (3:1) solution, the PR/G became ready for transfer process. As distinct from our previous work 'G/n-Si PDA with common graphene electrode' fabrication route [18], large area grown monolayer graphene was transferred on arrayed SOI substrate following the fabrication of Si array and shaped with thick photoresist (t~15 µm) using photolithography, subsequently graphene was etched with O 2 plasma to separate graphene electrodes. Following the graphene etching procedure, the windows for metal contact pads were defined by an additional lithography step on individually separated elements.…”