Graphite film/aluminum laminate composites with ultrahigh thermal conductivity for thermal management applications

Huang, Yukun; Ouyang, Qiubao; Guo, Qiang; Guo, Xingwu; Zhang, Guoding; Zhang, Di

doi:10.1016/j.matdes.2015.10.146

Cited by 90 publications

(25 citation statements)

References 32 publications

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“…The intermeshed 3D networks provide a pathway for phonon diffusion to occur with minimal phonon scattering. Recently, the integration of nanofillers, such as copper–graphite, copper–graphene, aluminum–graphite, and aluminum–graphene into matrix materials to obtain higher TC has been widely studied.…”

Section: Enhancement Methods Of the Thermal Propertiesmentioning

confidence: 99%

Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials

Zhang

Zeng

Zhai

et al. 2017

Macro Materials & Eng

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Recent years have witnessed a staggering escalation in the power density of modern electronic devices. Because increasingly high power density accumulates heat, efficient heat removal has become a critical limitation for the performance, reliability, and further development of modern electronic devices. Thermal interface materials (TIMs) are widely employed between the two solid contact surfaces of heat sources and heat sinks to increase heat removal for electric devices. Composites of graphene and matrix materials are expected to be the most promising TIMs because of the remarkable thermal conductivity of graphene. Here, the recent research on the thermal properties of graphene filled polymer composite TIMs is reviewed. First, the composition of graphene filled polymer composite TIMs is introduced. Then, the synthetic methods for graphene filled polymer composite TIMs are primarily described. This study focuses on introducing the methods for improving and characterizing the thermal properties of graphene filled polymer composite TIMs. Furthermore, the challenges facing graphene filled polymer composite TIMs for thermal management applications in the modern electronic industry and the further progress required in this field are discussed.

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Section: Enhancement Methods Of the Thermal Propertiesmentioning

confidence: 99%

Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials

Zhang

Zeng

Zhai

et al. 2017

Macro Materials & Eng

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“…Graphite has been the material most rigorously studied to understand its thermal properties and provides references to study the thermal behavior of nanostructured materials [8]. A large number of composites containing a carbon phase with enhanced thermal conductivities have been recently investigated as promising materials in this sense [9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Thermal conductivity of Fe graphitized wood derived carbon

et al. 2016

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Graphitic porous carbon materials from pyrolysis of wood precursors were obtained by means of a nanosized Fe catalyst, and their microstructure and electrical and thermal transport properties investigated. Thermal and electrical conductivity of graphitized carbon materials increase with the pyrolysis temperature, indicating a relationship between the degree of graphitization and thus in crystallite size with transport properties in the resulting carbon scaffolds. Evaluation of the experimental results indicate that thermal conductivity is mainly through phonons and decreases with the temperature in Fe-catalyzed carbons suggesting that due to defect scattering the mean free path of phonons in the material is small and defect scattering dominates over phonon-phonon interactions in the range from room temperature to 800ºC.

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“…The early applications in electronic packaging materials are mostly inorganic thermal insulation materials, such as metal oxides, nitride ceramics, and other nonmetallic materials, 4,5 and due to their own performance limitations, like high price, difficult to process, and other factors, they cannot meet the modern electronic packaging technology requirements. Polymer materials, as packaging materials, are simple, low cost, and suitable for mass production, therefore, it has become a hot spot of research.…”

Section: Introductionmentioning

confidence: 99%

Thermal conductivity enhancement of polyimide films filled with BN and AlN fillers

Liu

Zhang

et al. 2018

High Performance Polymers

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A series of polyimide (PI) composite films were prepared using PI as matrix and boron nitride (BN) and aluminum nitride (AlN) as the doped phases. The modification of the thermal conductive filler particles was characterized by Fourier transform infrared (FTIR). The results showed that the silane coupling agent KH550 was successfully coated on the surface of BN and AlN. X-ray photoelectron spectrometer characterization was used to further prove that silane coupling agents were successfully attached to BN and AlN surfaces, forming a new chemical bond. Scanning electron microscope (SEM) was used to analyze the dispersion of filler particles in the matrix. It was found that agglomeration phenomenon occurred when the content of BN particles were high, but this problem was improved after the surface modification of BN. The breakdown field strength and volume resistivity of PI/BN composite film increased first and then decreased with the increase of BN content and reached the maximum when the volume fraction of BN was 5%, which was 191.53 kV/mm and 8.832 × 1013 Ω·m, respectively. When the BN content was 9 vol%, the thermal conductivity of the PI/BN composite film was 0.496 W/(m·K), which was 1.4 times larger than that of the pure PI film. The thermal conductivity of the PI/BN/AlN composite film at the BN and AlN contents of 5 vol% and 1 vol%, respectively, is 0.144 W/(m·K) higher than that of 7 vol% PI/BN. It indicated that the synergistic effect of the composite fillers played a significant role, and at the same time, under the premise of ensuring higher thermal conductivity, the amount of thermally conductive particles could be reduced to some extent. After the surface modification of the filler particles, the properties of the composite film showed the same trend compared with the unmodified one, while the only difference was that there was a certain increase in the numerical value.

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Graphite film/aluminum laminate composites with ultrahigh thermal conductivity for thermal management applications

Cited by 90 publications

References 32 publications

Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials

Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials

Thermal conductivity of Fe graphitized wood derived carbon

Thermal conductivity enhancement of polyimide films filled with BN and AlN fillers

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