Graphite Nanocomposite Substrates for Improved Performance of Flexible, High-Power AlGaN/GaN Electronic Devices

Burzynski, Katherine; Glavin, Nicholas R.; Snure, Michael; Motala, Michael J.; Ferguson, J. B.; Blanton, Eric W.; Heckman, Emily M.; Muratore, Christopher

doi:10.1021/acsaelm.0c01063

Cited by 4 publications

(1 citation statement)

References 64 publications

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“…Carbon-based nanofillers are especially promising for this purpose since they combine good thermal conductivity (from ∼2000 Wm -1 K -1 for graphene to ∼100 Wm -1 K -1 for bulk graphite [92]) with low density. By using graphite nanoplatelets, Burzynski et al managed to increase the thermal conductivity of PDMS 9× to 1.8 Wm -1 K -1 at only 11 vol% filler content [86].…”

Section: Thermal Propertiesmentioning

confidence: 99%

Biodegradable and Nanocomposite Materials as Printed Circuit Substrates: A Mini-Review

Géczy

Farkas

Kovács

et al. 2022

IEEE Open J. Nanotechnol.

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Biodegradables are a promising path for the future of electronics in a greener mindset. The review study focuses on their applications and past and current research results. The paper also investigates the application of nanomaterials as fillers to control or increase the physical (electrical, mechanical, thermal) properties of biodegradable biopolymers. These biodegradables and nanocomposites are already effectively used in prototypes and advanced application areas with demanding requirements, such as flexible and wearable electronics, implantable or biomedical applications, and traditional commercial electronics. The nanoenhanced biopolymer substrates (e.g., with improved gas and water barrier functionalities) sometimes also with integrated, nanoenabled functionalities (such as electromagnetic shielding or plasmonic activity) can be beneficial in many electronics packaging and nanopackaging applications as well.

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Section: Thermal Propertiesmentioning

confidence: 99%

Biodegradable and Nanocomposite Materials as Printed Circuit Substrates: A Mini-Review

Géczy

Farkas

Kovács

et al. 2022

IEEE Open J. Nanotechnol.

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Unified modeling and experimental realization of electrical and thermal percolation in polymer composites

Sarikhani

Arabshahi

Saberi

et al. 2022

Applied Physics Reviews

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Correlations between electrical and thermal conduction in polymer composites are blurred due to the complex contribution of charge and heat carriers at the nanoscale junctions of filler particles. Conflicting reports on the lack or existence of thermal percolation in polymer composites have made it the subject of great controversy for decades. Here, we develop a generalized percolation framework that describes both electrical and thermal conductivity within a remarkably wide range of filler-to-matrix conductivity ratios ([Formula: see text]), covering 20 orders of magnitude. Our unified theory provides a genuine classification of electrical conductivity with typical [Formula: see text] as insulator–conductor percolation with the standard power-law behavior and of thermal conductivity with [Formula: see text] as poor–good conductor percolation characterized by two universal critical exponents. Experimental verification of the universal and unified features of our theoretical framework is conducted by constructing a 3D segregated and well-extended network of multiwalled carbon nanotubes in polypropylene as a model polymer matrix under a carefully designed fabrication method. We study the evolution of the electrical and thermal conductivity in our fabricated composites at different loading levels up to 5 vol. %. Significantly, we find an ultralow electrical percolation threshold at 0.02 vol. % and a record-low thermal percolation threshold at 1.5 vol. %. We also apply our theoretical model to a number of 23 independent experimental and numerical datasets reported in the literature, including more than 350 data points, for systems with different microscopic details, and show that all collapse onto our proposed universal scaling function, which depends only on dimensionality.

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Effect of surface potential pinning on strain behavior of AlGaN/GaN device structures

Blanton

Prusnick

Green

et al. 2023

Applied Physics Letters

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Understanding the varied strain effects in AlGaN/GaN devices is crucial for realizing optimized flexible electronics systems and strain sensors. Here, we report on the effects of surface potential pinning, altered by the deposition of device-relevant SiNx passivation and Ni gate layers, on the strain-dependent carrier density, ns, of AlGaN/GaN two-dimensional electron gas structures. Flexible van der Pauw samples were made by separating AlGaN/GaN layers from the sapphire growth substrate using a two-dimensional boron nitride van der Waals release layer and transferring them to flexible substrates. For bare surface samples, we observed relatively large decreases in ns with tensile strain (Δns of −2 × 1011 cm−2 at 0.1% uniaxial strain), indicating an unpinned AlGaN surface potential. For the SiNx and Ni covered samples, the ns-strain trends were nearly flat, indicating a more pinned surface potential. Additionally, sub-bandgap 400 nm light is shown to effectively pin the surface potential as evidenced by flattening the ns-strain trend, the mechanism of which we explain in terms of the persistent photoconductivity effect. These observations could have important implications in tuning strain sensors and minimizing device variability in flexible electronics.

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Graphite Nanocomposite Substrates for Improved Performance of Flexible, High-Power AlGaN/GaN Electronic Devices

Cited by 4 publications

References 64 publications

Biodegradable and Nanocomposite Materials as Printed Circuit Substrates: A Mini-Review

Biodegradable and Nanocomposite Materials as Printed Circuit Substrates: A Mini-Review

Unified modeling and experimental realization of electrical and thermal percolation in polymer composites

Effect of surface potential pinning on strain behavior of AlGaN/GaN device structures

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