Green SoCs for a sustainable Internet-of-Things

Bol, David; Vos, Julien De; Botman, François; Streel, Guerric de; Bernard, Sebastien; Flandre, Denis; Legat, Jean-Didier

doi:10.1109/ftfc.2013.6577767

Cited by 46 publications

(19 citation statements)

References 3 publications

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“…Additionally, these systems target memory-processor communication where speed is of high importance. However, the nature of sensing and more broadly IoT applications requires a different design approach since power and cost are often more important than speed [27].…”

Section: Previous Workmentioning

confidence: 99%

Contactless Heterogeneous 3-D ICs for Smart Sensing Systems

Papistas

Pavlidis

2018

Integration

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A heterogeneous contactless transceiver circuit is designed to provide inter-tier signalling for a 3-D system considering specific bonding constraints. The system is composed of two tiers, a 65 nm processing tier and a 0.35 µm sensing tier. Face-to-back integration is chosen to support fluidic sensing. Half duplex communication between the tiers is provided through inductive links. Each tier is considered to be fabricated in a different technology to enable low manufacturing cost and benefit from the advantages each technology offers. Both the uplink and downlink transceivers achieve data rates that reach 1 Gbps with non-return-to-zero data encoding. Energy efficiency is the predominant objective, with the uplink dissipating 5.28 pJ/b and 8.67 pJ/b for the downlink. A 6.8× power reduction is demonstrated when using heterogeneous technologies, compared to a state-of-the-art 0.35 µm transceiver, while the dissipated energy is decreased by 37.5% as compared to a state-of-the-art 65 nm transceiver. Process variation analysis is also performed to ensure the proposed circuit operates correctly across several process corners, covering a broad design space. To improve system robustness, an overhead of 2.3% on the peak power and < 1% on the average power is shown, respectively.

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Section: Previous Workmentioning

confidence: 99%

Contactless Heterogeneous 3-D ICs for Smart Sensing Systems

Papistas

Pavlidis

2018

Integration

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“…For example, many research projects exist which suggest the use of wireless cloud devices, internet of things nodes or smartphones [33] to drive behavior change in energy use. However, unless such projects make serious consideration of their use of energy, both that involved in running the wireless cloud infrastructure that supports it [13] and the embedded energy involved in building smartphones and networks [58], they may be counter-productive [9].…”

Section: Hci Must Promote a Culture Of Respect For Other Fieldsmentioning

confidence: 99%

Misrepresentation of Health Research in Exertion Games Literature

Marshall

Linehan

2017

Proceedings of the 2017 CHI Conference on Human Factors in Computing Systems

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HCI often requires scholars to build upon research from fields outside their expertise, creating the risk that foundational work is misunderstood and misrepresented. The prevailing goal of "exergames" research towards ameliorating obesity appears to be built on just such a misunderstanding of health research. In this paper, we analyse all citations to a single influential study, which has been extensively cited to justify research on exergames. We categorise the 375 citations based on whether they represent the findings of that study accurately or inaccurately. Our findings suggest that 69% of exergames papers citing this study misrepresent the findings, demonstrating a systematic failure of scholarship in exergames research. We argue that exergaming research should cease focusing on games as treatment for obesity, and that HCI publications should demand more critical and scholarly engagement with research from outside HCI.

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“…The major application of IoT is in designing the smart entities such as city, building, academics, machine control, autonomous transportation, medical science, real-time systems, and computing technologies [2]. The image processing and green computing application are implemented in SoC FPGA for satisfying IoT requirements; such efforts have been studied in a few articles [3,4]. End users want thinner electronic devices, which are also more advanced, cheaper, powerful, easy to use, and capable of performing heterogeneous activities.…”

Section: Introductionmentioning

confidence: 99%

Lightweight signature scheme to protect intellectual properties of Internet of things applications in system on chip field-programmable gate arrays

Kokila¹,

Ramasubramanian²

2019

Turk J Elec Eng & Comp Sci

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Billions of smart objects in the edge devices offer advanced connectivity to networks which increase the security and complexity of the Internet of things (IoT) applications. To make such entities smarter heterogeneous intellectual property (IP) cores from multiple service providers are reused in system on chip platform. Enabling both chip and IP protection at post fabrication level is imperative. The IoT-based IP cores are signed with the hybrid physical unclonable function and finite state machine model to protect from cloning, misuse, unauthorized user access, and physical attacks. The extended finite-state machine is used to verify the signature, which reduces the space and time complexity. The goal is to design a secure plug-and-play system which supports IoT IP core for the unique chip without using any complex algorithms and huge memory storage. Experimental results show that the average overhead values of area and power are 1.05% and 1.08% less, respectively, compared with the existing IP protection.

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Green SoCs for a sustainable Internet-of-Things

Cited by 46 publications

References 3 publications

Contactless Heterogeneous 3-D ICs for Smart Sensing Systems

Contactless Heterogeneous 3-D ICs for Smart Sensing Systems

Misrepresentation of Health Research in Exertion Games Literature

Lightweight signature scheme to protect intellectual properties of Internet of things applications in system on chip field-programmable gate arrays

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