Grinding Marks in Back Grinding of Wafer with Outer Rim

Zhu, Xianglong; Li, Yu; Dong, Zhigang; Kang, Renke; Gao, Shang; Li, Liansheng

doi:10.1177/0954406220912787

Cited by 8 publications

(3 citation statements)

References 16 publications

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“…Wafer surface quality is significant because it can enhance the performance and lifespan of IC devices [4,5]. Ultra-precision grinding is frequently utilized in the manufacturing process of silicon wafers, and obtaining wafers with high surface quality by ultra-precision grinding has attracted the attention of scholars [6,7]. Kang et al [8] developed a new elastic grinding tool called the grind-polishing wheel.…”

Section: Introductionmentioning

confidence: 99%

Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

Wu,

Cheng,

Zhang

et al. 2023

J. Phys.: Conf. Ser.

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The grind-polishing wheel is a new non-woven structure grinding tool with low elastic modulus and ultra-fine abrasive grains, which can obtain high surface/sub-surface quality ground silicon wafers. To obtain high-shape flatness during grinding with the grind-polishing wheel, a prediction model of the ground silicon wafers’ flatness considering the elastic modulus of the wheel, processing parameters, and abrasive grain size is developed. The grinding experiments under different speed ratios were conducted to verify the prediction model accuracy. It shows that the model can successfully predict the flatness of ground silicon wafers, and the error of the prediction model is less than 13%. The proposed model has some guiding significance for choosing the appropriate character of the grind-polishing wheel and grinding parameters to achieve desirable flatness for silicon wafers.

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Section: Introductionmentioning

confidence: 99%

Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

Wu,

Cheng,

Zhang

et al. 2023

J. Phys.: Conf. Ser.

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“…While the application of surgical implants requires high assemble precision between parts, enhancing the surface integrity is extremely important for increasing the performance of pure titanium-based parts. Although precision multi-grain grinding is a common machining method for efficiently preparing high precision surfaces of a variety of materials, [4][5][6][7] the machinability of pure titanium under grinding is largely unknown.…”

Section: Introductionmentioning

confidence: 99%

Experimental and finite element investigation of precision multi-grain grinding of pure titanium

Zhang²,

Zhang

et al. 2022

Proceedings of the Institution of Mechanical Engineers, Part B:

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Pure titanium composed of α single-phase has important applications for its excellent mechanical, physical, and chemical properties, which also impose high requirements on its surface finish. However, pure titanium is a difficult-to-machine material due to its low mass transportation caused by the low stiffness and the low thermal conductivity. Thus, it is greatly needed to investigate the machinability of pure titanium by precision grinding. In the present work, we carry out experimental and finite element simulation studies on the precision multi-grain grinding of pure titanium. Specifically, finite element model of pure titanium grinding using grinding wheel with multiple grains is established, which enables the prediction of successive material removal behavior by neighboring grains in line with experiments. The machining behavior of pure titanium and its correlation with machined surface morphology and grinding force are studied by experiment, and are further revealed by finite element simulation. Subsequent grinding experiments are performed to study the effects of workpiece speed and grinding depth on the ground surface quality of pure titanium, with which a surface roughness of 0.27 μm is obtained under the optimized grinding parameters.

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“…These studies are instrumental to the model development for the BGWOR process, but cannot be applied directly. As far as the authors know, among the published papers, only one paper 13 of our research group studied the BGWOR process. That paper studied the evolution of grinding marks in BGWOR.…”

Section: Introductionmentioning

confidence: 99%

The effect of the chuck shape on the wafer topography in back grinding of wafer with outer rim

Zhu

Yao

Guo

et al. 2021

Advances in Mechanical Engineering

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Back Grinding of Wafer with Outer Rim (BGWOR) is a novel method for carrier-less thinning of silicon wafers. Silicon wafers are widely used in integrated circuits (ICs). The topography of the wafer will not only directly affect the efficiency of subsequent processing of semiconductor devices, but correspondingly affect the performance and life of these devices. However, there are few studies on the shape of the ground wafer in BGWOR. In this paper, the mathematical model of the wafer topography in BGWOR was developed. With this model, the radial thickness and total thickness variation (TTV) of a wafer under different parameters, including inclination angles and radii of grinding wheel for dressing chuck, were simulated by MATLAB. Inclination angles and radii of grinding wheels for the dressing chuck had a great influence on the radial thickness and TTV of a wafer in the BGWOR. Lastly, the pilot experiments were conducted to validate the theoretical model of grinding topography and TTV of the wafer in BGWOR. To enhance the flatness of the ground wafer, it is essential to control the shape of the dressing chuck. The research results are helpful to the optimization of the dressing process of the chuck in the BGWOR.

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Grinding Marks in Back Grinding of Wafer with Outer Rim

Cited by 8 publications

References 16 publications

Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

Experimental and finite element investigation of precision multi-grain grinding of pure titanium

The effect of the chuck shape on the wafer topography in back grinding of wafer with outer rim

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