Electrospray deposition is fast finding application in the field of thin film device manufacturing processes. The ease and cost efficiency attached to electrospray deposition with possible integration with roll-to-roll fabrication lines is the potential future of thin film device manufacturing. In this study thin films composed of copper-indium-diselenide, more commonly known as CIS, have been made using the electrospray deposition of nano-particle based inks for the ultimate manufacture of CIS-based solar cells. It is the first time that a complete CIS layer has been deposited through electrospray in a single step without involving any other process. Deposited layers are thoroughly characterized using techniques such as scanning electron microscope, Xray diffraction and X-ray photoelectron spectroscopy. Moderate voltage requirements, dense, large grained, *1 lm thick layers and reasonable sintering temperatures involved in the electrospray deposition process promise the possible applicability of electrospray deposition in the manufacturing of cheap and easy to build solar cells.