Metal-oxide-semiconductor field-effect
transistors (MOSFETs)
based
on wide-band-gap semiconductors have garnered significant attention
for their potential in high-performance and energy-efficient electronic
devices. In this study, we explore the low-temperature growth, characterization,
and performance of ZnGa2O4 film based MOSFETs
on sapphire substrates through the utilization of radio frequency
(RF) magnetron sputtering. The characteristics of ZnGa2O4 films were meticulously investigated at various annealing
temperatures, specifically 400, 600, and 900 °C. Our findings
revealed that the crystallinity of ZnGa2O4 films
was notably superior at a low annealing temperature of 400 °C.
Subsequently, we fabricated MOSFET devices by patterning the ZnGa2O4 films to create gate, source, and drain regions
using a conventional photolithography process. The electrical characteristics
of the ZnGa2O4 MOSFETs were thoroughly examined,
unveiling their operation in the depletion mode. These devices exhibited
a threshold voltage of −5 V, a maximum drain current of 110
mA/mm, a remarkable high drain current on–off current ratio
of 107, and an excellent breakdown voltage of 575 V, underlining
their suitability for high-power applications. This research demonstrates
the successful fabrication of ZnGa2O4 based
depletion-mode MOSFETs using a sputtering technique, offering a pathway
toward the development of next-generation electronic devices with
enhanced performance.