2008
DOI: 10.1016/j.jcrysgro.2008.05.056
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Growth and characterization of the AlInGaN quaternary protective layer to suppress the thermal damage of InGaN multiple quantum wells

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Cited by 9 publications
(3 citation statements)
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“…[1][2][3][4] Furthermore, owing to the higher thermal stability, using AlInGaN as the protection layer is effective to suppress the generation of non-radiative recombination centers in multiple quantum wells (MQWs) caused by thermal damage in the ramp-up process of metalorganic chemical vapor deposition (MOCVD). [5] Accordingly, AlInGaN is an ideal material for minimizing mismatch-induced strain and enhancing band offset in GaN-based heterostructure. [6] At present, most researchers concentrate on the enhanced luminescence efficiency for InGaN-based MQWs with different polarization-matched barriers.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4] Furthermore, owing to the higher thermal stability, using AlInGaN as the protection layer is effective to suppress the generation of non-radiative recombination centers in multiple quantum wells (MQWs) caused by thermal damage in the ramp-up process of metalorganic chemical vapor deposition (MOCVD). [5] Accordingly, AlInGaN is an ideal material for minimizing mismatch-induced strain and enhancing band offset in GaN-based heterostructure. [6] At present, most researchers concentrate on the enhanced luminescence efficiency for InGaN-based MQWs with different polarization-matched barriers.…”
Section: Introductionmentioning
confidence: 99%
“…Although room-temperature ZT values of In 0:1 Ga 0:9 N:(Er+Si) and Al 0:1 In 0:1 Ga 0:8 N:(Er+Si) are similar, we preferred Al 0:1 In 0:1 -Ga 0:8 N:(Er+Si) alloys because, for the same In content, AlInGaN alloys have been found more thermally stable than InGaN alloys at high temperature. 23) The Seebeck coefficient S and electrical conductivity of an optimized quaternary alloy, Al 0:1 In 0:1 Ga 0:8 N:(Er+Si), were measured simultaneously from room temperature to about 1055 K. As shown in Fig. 3, as temperature was increased from room temperature to 1055 K, S value was increased from 124 to 193 V/K but decreased from 200 to 135 (Ácm) À1 .…”
mentioning
confidence: 98%
“…However, thermal stability of AlInGaN at high temperature is better than that of InGaN. 23) We have checked the thermal stability of AlInGaN epilayers deposited on GaN/AlN/sapphire templates by measuring the structural and electronic transport properties before and after annealing the epilayers at 1010 K in air for 3 h. It was found that AlInGaN epilayers with In-contents above 0.3 partially decomposed, while those with In-contents below 0.2 retain their original properties after annealing. Thus, we limit the In-content to 10% for TE properties study.…”
mentioning
confidence: 99%