The heteroepitaxial growth of vertically aligned gallium
nitride
(GaN) single-crystalline microrod arrays on silicon substrates was
achieved with high reproducibility by using the plasma-enhanced chemical
vapor deposition (PECVD) method in the furnace. By reducing the plasma
power from 70 to 15 W, the crystal morphology of GaN varied from thin
films to microrod arrays with the decreased V/III gas ratio. The growth
of GaN crystals occurred in the vertical direction of the substrate
and in the lateral direction of the growth axis via the self-catalytic
vapor–liquid–solid mechanism (VLS mechanism) and the
vapor–solid mechanism (VS mechanism), respectively, contributing
to the formation of inverted hexagonal GaN cone microrods. Furthermore,
the morphology of inverted hexagonal GaN cone microrods shows extremely
small contact areas between the microrods and the substrate, suggesting
the potential to solve the problems of stress accumulation and poor
crystalline qualities of heteroepitaxy. With the raised growth temperature
of GaN from 930 to 980 °C, the material quality was improved
and the high crystalline qualities were obtained, owing to the successful
surface migration of gallium atoms. However, the density of GaN microrods
became lower with the increased growth temperature because the spatial
temperature gradient was reduced and the evaporation of gallium was
enhanced, leading to fewer gallium atoms precipitating and remaining
on the substrate. The growth direction of vertically aligned GaN single-crystalline
microrod arrays with the (002) crystal plane is along the [0001] orientation
(c axis) and normal to the substrate surface, which
may bring about many device applications in future studies.