Growth Behavior of IMCs and Fracture Forming Mechanism at Sn-Ag-Cu/Cu Interfaces under Thermal-Shearing Cycling Condition

Liu, Qi; Huang, Jihua; Li, Hua; Zhao, Xingke; Zhang, Huanhuan

doi:10.1109/icept.2006.359764

Cited by 2 publications

(2 citation statements)

References 8 publications

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“…Ni can optimize the microstructure of solders [27,28]. Adding 0.1 wt.% Ni to Sn-3.5 Ag can greatly inhibit the growth of Ag 3 Sn during welding and subsequent solid-state aging processes [29,30]. Hammad reported that Ni elements could diffuse from the molten solder matrix into the intermetallic compound particles, forming Ni 3 Sn 4 IMCs during the solidification process, thus improving the microstructure of solders and increasing the life of electronic components [31].…”

Section: Of 18mentioning

confidence: 99%

Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions

et al. 2023

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Low Ag lead-free Sn-Ag-Cu (SAC) solders have attracted great interest due to their good drop resistance, high welding reliability, and low melting point. However, low Ag may lead to the degradation of the mechanical properties. Micro-alloying is an effective approach to improving the properties of SAC alloys. In this paper, the effects of minor additions of Sb, In, Ni, and Bi on microstructure, thermal and mechanical properties of Sn-1 wt.%Ag-0.5 wt.%Cu (SAC105) were systematically investigated. It is found that the microstructure can be refined with intermetallic compounds (IMCs) distributed more evenly in the Sn matrix with additions of Sb, In, and Ni, which brings a combined strengthening mechanism, i.e., solid solution strengthening and precipitation strengthening, leading to the tensile strength improved of SAC105. When Ni is substituted by Bi, the tensile strength is further enhanced with a considerable tensile ductility higher than 25%, which still meets the practical demands. At the same time, the melting point is reduced, the wettability is improved, and the creep resistance is enhanced. Among all the investigated solders, SAC105-2Sb-4.4In-0.3Bi alloy possesses the optimized properties, i.e., the lowest melting point, the best wettability, and the highest creep resistance at room temperature, implying that element alloying plays a vital role in improving the performance of SAC105 solders.

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Section: Of 18mentioning

confidence: 99%

Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions

et al. 2023

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“…During the soldering process, metallurgical reaction between liquid solder and copper pads or pads with Ni/Au metallization forms a layer of intermetallic compound (IMC) at the solder/metallization interface. The interfacial reactions of Sn thin-film, Sn-Pb, SnAg, and Sn-Ag-Cu bulk solders with Cu pads have been investigated by a number of researchers [4][5][6][7][8][9]. They all showed that the intermetallic compounds formed during these interfacial reactions were of the Cu 3 Sn (ε) and Cu 6 Sn 5 (η) phase.…”

Section: Introductionmentioning

confidence: 99%

Study of interfacial reactions between Sn3.5Ag0.5Cu alloys and Cu substrate

Tsao

Chang

Sun

et al. 2009

2009 International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Interfacial reactions between Sn3.5Ag0.5Cu lead-free solders (SAC) and Cu were investigated during soldering reactions between liquid SAC and Cu substrate at 250, 260, 275, 300 and 325°C for various reaction times. Experimental results show that a scallop-shaped layer of Cu 6 Sn 5 intermetallic compounds formed during the soldering. Kinetics analysis shows that the growth of such interfacial Cu 6 Sn 5 intermetallic compounds is diffusion controlled with an activation energy of 65.69 kJ/mol. This interesting behavior of IMC dissolution is attributed to the relatively high solubility of Cu in liquid solders.

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Growth Behavior of IMCs and Fracture Forming Mechanism at Sn-Ag-Cu/Cu Interfaces under Thermal-Shearing Cycling Condition

Cited by 2 publications

References 8 publications

Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions

Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions

Study of interfacial reactions between Sn3.5Ag0.5Cu alloys and Cu substrate

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