“…In addition to partially and selectively melting away those parts of the material that are structurally-defective/energetically-costly, as has been explained above, this outcome further requires that the formation of defects be avoided during the ensuing lateral solidification process. Although it is possible for one to enumerate a number of factors encountered during multi-MPS that can be recognized as being conducive to defect-free solidification (e.g., relatively slow solidification rates resulting from relatively small degrees of interfacial undercooling, stable interfaces with mostly positive curvatures expected during the growth (i.e., the absence of re-entrant corners and cusps), relatively short lateral growth distances, the (1 0 0)-surface orientation being often associated with relatively defect-free growth in both melt-mediated and solid-phase crystallization of Si films [8,19,20], the highly unusual ''inverted'' interface thermal profile [4] etc. ), a definitive understanding of the above observations remains to be elucidated.…”