2016
DOI: 10.1149/2.0691608jes
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Growth Mechanism and Application of Nanostructures Fabricated by a Copper Sulfate Solution Containing Boric Acid

Abstract: In this research, a nanostructured copper surface was fabricated using a CuSO4·5H2O solution containing boric acid. Cu and Cu2O structures simultaneously formed when the electrodeposition was performed using the CuSO4·5H2O solution. The Cu deposition ratio increased when the concentration of CuSO4·5H2O decreased or the applied current density increased. In contrast, the Cu2O deposition ratio increased when the concentration of CuSO4·5H2O increased or the applied current density decreased. A nanoplate-type Cu s… Show more

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Cited by 16 publications
(5 citation statements)
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“…As can be observed from Figure 3, the potential of cathodic reactions shifts to the more negative values when boric acid is added to the electrodeposition bath. This potential reduction in the onset of the electrodeposition reactions can be explained by the capping and crystal growth modifying behavior of boric acid [59]. Essentially, boric acid molecules initially act as a buffering agent by attracting OH − ions that formed near the substrate and result in H 2 evolution.…”
Section: Resultsmentioning
confidence: 99%
“…As can be observed from Figure 3, the potential of cathodic reactions shifts to the more negative values when boric acid is added to the electrodeposition bath. This potential reduction in the onset of the electrodeposition reactions can be explained by the capping and crystal growth modifying behavior of boric acid [59]. Essentially, boric acid molecules initially act as a buffering agent by attracting OH − ions that formed near the substrate and result in H 2 evolution.…”
Section: Resultsmentioning
confidence: 99%
“…1 (reduction of Cu 2+ ions) and Eq. 2 (reduction of Cu + ions) [11,19]. Figure 1b shows the shape of the electrodeposited structure formed when the solution was stirred at 200 rpm during the electrodeposition.…”
Section: Results Of Cu Alloy Electrodeposition On Non-patterned Substmentioning
confidence: 99%
“…Using this electrodeposition method, the time and cost required for the fabrication of metallic microstructures can be significantly reduced. Moreover, electrodeposition methods allow the formation of various shapes of the metal alloy structure by controlling simple variables such as the stirring rate, temperature, and applied current density [11,12].…”
Section: Introductionmentioning
confidence: 99%
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“…19,20 Controlling the Cu 2 O surface morphology and particle sizes allows one to decrease the Cu 2 O photoproduction electron-hole recombination rate and thus improve its photoelectric properties. In the electrochemical deposition process, the deposition potential, 21 solution composition, 22,23 and pH 24 influence the surface morphology and particle sizes of Cu 2 O. Many researchers have focused on varying the electrochemical deposition parameters to control the surface morphology and particle sizes of Cu 2 O.…”
mentioning
confidence: 99%