2019
DOI: 10.1016/j.physb.2019.03.023
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Growth of Cu2InO4 thin films on Si substrate by thermal evaporation technique and enhancement of thermoelectric properties by post-growth annealing

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Cited by 28 publications
(4 citation statements)
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“…57 The top-down approach, despite its convenience, is not well suited to producing nanoparticles with small sizes and unified shapes. Physical techniques, including ball milling, 58,59 thermal evaporation, 60,61 laser ablation, 62 and sputtering, 63,64 are some examples of methods adopting the top-down approach. However, these techniques are usually costly because they require considerable amounts of energy to maintain hightemperature and high-pressure conditions during the production process.…”
Section: Nanoparticle Synthesis Strategiesmentioning
confidence: 99%
“…57 The top-down approach, despite its convenience, is not well suited to producing nanoparticles with small sizes and unified shapes. Physical techniques, including ball milling, 58,59 thermal evaporation, 60,61 laser ablation, 62 and sputtering, 63,64 are some examples of methods adopting the top-down approach. However, these techniques are usually costly because they require considerable amounts of energy to maintain hightemperature and high-pressure conditions during the production process.…”
Section: Nanoparticle Synthesis Strategiesmentioning
confidence: 99%
“…More than 80% of world energy is obtained by fossil fuel with more than half of this energy is wasted in the form of heat. As the world energy consumption continues to rise, so the shifting toward renewable energy resources like windmill, solar energy, hydroelectric, thermo-electric devices and fuel cells is necessary [1][2][3][4]. Thermo-electric materials are the hot topic for the researchers nowadays because of their excellent energy harvesting properties i.e.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, Molybdenum exhibits a high stacking fault energy because of its bcc lattice structure [17]. In this method, it is possible to produce different combined alloy material like Cu 2 InO 4 chemically alloyed thin film on silicon substrate under 2 � 10 À 2 Torr of O 2 gas flow [18]. It should be taken into consideration that thermal evaporation method is used for the evaporation of many metallic materials and is generally useful in device construction.…”
Section: Introductionmentioning
confidence: 99%