Growth of electrolytic copper dendrites. I: Current transients and optical observation

Growth of electrolytic copper dendrites. III: Influence of the presence of copper sulphate

“…As already shown in paper I [29], when the activation current is higher the current increases with time whereas when the current is low, the current is time-independent showing a more filamentary morphology of the dendrites. In addition, for low currents (far from the diffusion limiting current from Newman [27]) the growth rate of the dendrite is time-independent, which is the case for the lowest concentrations of copper sulfate in 10 À4 M oxalic acid solutions.…”

“…The experimental set-up used to record the current transients and to measure the dendrite length has been given in details in paper I [29]. From the recording of the current transient which follows the application of a potential difference between two 250 lm in diameter copper microelectrodes, it is possible to determine the short circuit time, which is the time necessary to develop on the cathode a dendrite sufficiently long to contact the anode.…”

“…The dendrites were characterized by using a technique, described in details in the first paper [29] of this series of three (called paper I in the following), based on the coupling on a microvideo observation with electrochemical measurements. This technique allows the current transients and the dendrite length to be simultaneously measured.…”

Sharp-interface model of electrodeposition and ramified growth

“…Electrodeposition is a technologically important process with diverse applications and implications, e.g., for battery technology, electroplating, and production of metal powders and microstructures [1][2][3][4][5][6][7][8][9][10][11]. For well over a century it has been known, however, that the layer deposited during electrodeposition is prone to morphological instabilities, leading to ramified growth of the electrode surface.…”

Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates

“…15 The failure mechanism involves growth of dendrites, which bridge the electrode spacing between adjacent conductors on an insulating substrate and lead to electrical failure, as our previous paper about silver migration suggested. [16][17][18][19] Vaughen et al had reported that electrolytic copper migration occurred between copper conductors driven by electric field and moisture at room temperature to 50°C. 20 In the present work, we investigate the migration of copper residue at the surface of …”