“…[5][6][7] For the tunnel passivated layer, SiO 2 is not the only option, and it has been confirmed that Si nitride (SiN x ) can also work well in passivated contact under appropriate conditions. 8) There are many methods to form thin tunnel SiN x films, such as sputtering, 9) jet vapor deposition, 10,11) atomic layer deposition, 12) plasma-enhanced chemical vapor deposition (PECVD), [13][14][15] and direct nitridation, 16,17) some of which have been conventionally used in the industry of semiconductor devices. 18,19) Of a variety of methods, catalytic CVD (Cat-CVD), often also referred to as hot-wire CVD, may be one of the best ways for the formation of thin tunnel SiN x .…”