2017
DOI: 10.1016/j.mssp.2017.05.015
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Growth of silicon nitride by nitridation of amorphous silicon at low temperature in hot-wire CVD

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Cited by 12 publications
(4 citation statements)
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“…The reactivity of NDCA molecules on Si 3 N 4 grown via SuMBD is further evidenced by comparison of the substrate-specific N 1s core level spectra (Figure 2c). The NDCAfunctionalized Si 3 N 4 surface (upper panel in Figure 2c) exhibits a weak additional com-ponent (N B ) with respect to the etched Si 3 N 4 substrate (upper panel in Figure 2c) [31], corresponding to the surface nitrogen component that reacted with the NDCA molecule.…”
Section: Core Levelmentioning
confidence: 99%
“…The reactivity of NDCA molecules on Si 3 N 4 grown via SuMBD is further evidenced by comparison of the substrate-specific N 1s core level spectra (Figure 2c). The NDCAfunctionalized Si 3 N 4 surface (upper panel in Figure 2c) exhibits a weak additional com-ponent (N B ) with respect to the etched Si 3 N 4 substrate (upper panel in Figure 2c) [31], corresponding to the surface nitrogen component that reacted with the NDCA molecule.…”
Section: Core Levelmentioning
confidence: 99%
“…A schematic configuration for the HWCVD process is shown in Figure 7c, where the precursors decompose on the hot filament to produce the deposition species. [ 93 ] Significantly, HWCVD not only allows for improved control over the deposition parameters such as the deposition rate, but as the heating is largely confined to the wire, it allows for depositions at low substrate temperatures. Further advantages of HWCVD are [ 94 ] 1) the semiconductor films can be produced with higher deposition rates; 2) it enables more conformal deposition without any plasma‐induced damage; and 3) it allows for deposition of highly condensed films with low hydrogen content.…”
Section: Laser‐processed Planar Photonic Devicesmentioning
confidence: 99%
“…[5][6][7] For the tunnel passivated layer, SiO 2 is not the only option, and it has been confirmed that Si nitride (SiN x ) can also work well in passivated contact under appropriate conditions. 8) There are many methods to form thin tunnel SiN x films, such as sputtering, 9) jet vapor deposition, 10,11) atomic layer deposition, 12) plasma-enhanced chemical vapor deposition (PECVD), [13][14][15] and direct nitridation, 16,17) some of which have been conventionally used in the industry of semiconductor devices. 18,19) Of a variety of methods, catalytic CVD (Cat-CVD), often also referred to as hot-wire CVD, may be one of the best ways for the formation of thin tunnel SiN x .…”
Section: Introductionmentioning
confidence: 99%