2011
DOI: 10.2320/matertrans.mbw201017
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Growth of Ti-Based Interface Layer in Cu(Ti)/Glass Samples

Abstract: Cu(Ti) alloy films with low-resistivity and excellent-adhesion have been successfully prepared on glass substrates. To gain further resistivity reduction and adhesion strength, growth of a Ti-based interface layer was investigated using Rutherford backscattering spectrometry (RBS) in the present study. Cu(0$5 at%Ti) alloy films were deposited on glass substrates and subsequently annealed in vacuum at 400$600 C for 0:5$24 h. Results were compared with those for samples on SiO 2 substrate previously obtained. Ti… Show more

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