Titanium dioxide (TiO 2 ) thin films were deposited by remoteplasma atomic layer deposition (RPALD). The process window was determined in the range from 150 to 300 8C for atomic layer deposition of TiO 2 thin film. The crystal structure and grain size of the TiO 2 thin films deposited by RPALD was controlled via the variations of the deposition temperature and post-deposition thermal annealing. The as-deposited TiO 2 thin film grown at 150 8C was amorphous whereas the TiO 2 thin films grown above 200 8C were polycrystalline, consisting of anatase phase. As the deposition temperature increased, the grain size of the anatase phase progressively decreased. Meanwhile, when annealed at 900 8C, the amorphous TiO 2 thin film deposited at 150 8C crystallized into anatase structure. The film deposited at 200 8C retained the anatase structure up to 900 8C while incurring minimal grain growth. However, the post-annealed TiO 2 thin films deposited at 250 and 300 8C partially transformed to the rutile structure, resulting in a mixture of anatase and rutile phases. It is speculated that the relatively large grain size of the films deposited below 200 8C likely suppressed the anatase ! rutile transformation during annealing as the reduction of total fraction of grains boundaries, which acted as primary nucleation sites for the rutile transition, delayed the anatase ! rutile transformation.