Growth Restriction of Copper Nanocones at the Microgroove’s Bottom and Adjacent Sidewall Regions of Finned Heat Sinks

Abstract

Controllable growth of copper nanostructures has attracted great interest due to their academic and commercial values. As compared to nanostructures, micro/nanoscale composite structures with more surface area available for high-efficiency heat transfer are preferable. Here, we report growth restriction of copper nanocones at the groove's bottom and adjacent regions of finned heat sinks as groove width is below 0.4 mm and groove depth is above 3 mm, which is ascribed to hydrogen bubbles' blockage. This finding will trigger more thinking about how to grow metal nanostructures in confined microenvironments, which are the matter basis for developing highperformance chip coolers.